Functional InterConnect (FIC) Devices IDT addresses the need for cost-effective, off-the-shelf solutions that offer lower-cost connectivity As new high-performance interfaces are adopted in Wireless Infrastructure applications, such as Serial RapidIO® (sRIO) and Common Public Radio Interface (CPRI™), there is a requirement for cost-effective, off-the-shelf solutions that provide translation between these interfaces and legacy or less expensive ASICs and FPGAs. IDT meets this need with their family of Functional InterConnect (FIC) devices that offer low-cost connectivity between Serial RapidIO, CPRI, TDM and standard parallel interfaces. IDT FIC devices provide full-functional translation between the interfaces, eliminating the need for designers to implement this functionality in an ASIC or FPGA. Utilizing FIC off-the-shelf components allows the designer to utilize his valuable programmable logic resources on the high-value processing tasks that will differentiate his product in the marketplace. This also reduces design time and risk, saving development expenses and improving overall time-to-market, as well as minimizing system cost by off-loading the ASIC or FPGA of logic gate or serial transceiver requirements that can drive up their cost.  The base station block diagram below illustrates how the IDT CPRI FIC products enable both ends of the CPRI links between the baseband processing system and the three RF cards.   The block diagram shown in Figure 1 of the IDT Wireless Solutions page demonstrates how the IDT CPRI-FIC devices provide the connection between the RF card and the baseband processing system in the wireless base station. Translation options supported by the FIC devices include CPRI-to-sRIO, CPRI-to-TDM and sRIO-to-Parallel Interface. IDT wireless infrastructure solutions are an integral part of the worldwide communications network. From core routers enabling the network upon which the internet operates, to base stations and mobile devices that allow wireless communications, IDT devices enable a faster, more powerful digital media experience.  Learn more about IDT Wireless Infrastructure Solutions at www.IDT.com/go/wireless.

Functional InterConnect (FIC) Product Matrix

DEVICE 80HFC1001 80KFC1002 PORTS 3 CPRI 2 TDM (16 bit ports) 1 sRIO (1x or 4x) 1 Parallel (QDRII burst of 2) PACKAGE 19 x 19mm, 324 pin 23 x 23mm, 484 pin FEATURES CPRI v2.1 compliant Each CPRI port configurable as Master or Slave to support chain configurations TDM interfaces support dual channel configurations TDM control pins provided for seamless connection to popular ADC / DAC / DUC / DDC devices Multiplexing mode options sRIO 1.3 compliant Parallel port for external processor, FPGA, or memory 10Gbps throughput Status flags and water marks PERFORMANCE CPRI: 614.4 / 1228.8 / 2457.6 Mbaud TDM: up to 150 MHz per port sRIO: 1.25 / 2.5 / 3.125 Gbaud Parallel: 64-bits up to 200 MHz per port

FIC benefits features Reduces design time Standards based interfaces (sRIO rev 1.3, CPRI v2.1, QDRII) are used to seamlessly connect to other components to save time Dramatically reduces FPGA and ASIC costs Elimination of transceivers and extra logic provides up to 90 percent cost savings in FPGA expense Eases system design complexity and risk Proven, off-the-shelf components for shorter time-to-market Simplifies overall design architecture Pre-processing capabilities of PPS can be combined with FIC devices to do all translation and initial sample processing Provides system flexibility Data translation and formatting options available for sample manipulation Complete system solution When combined with the PPS and Serial Buffer, the FIC devices form the complete core solution for baseband processing applications News Releases, Literature related links to FIC and Wireless Infrastructure Solutions FIC product page on S-RIO website  News Release: Feb. 26, 2008- IDT Announces Optimized CPRI™ solution with Serial RapidIO ™ to Address Rapidly Evolving Wireless Market IDT Wireless Infrastructure Solutions web page