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IDT Announces Industry’s First Network Search Engine Manufactured on TSMC’s 90 Nanometer Process Technology

Leading Technology Innovators Leverage Intimate Knowledge of Design Expertise and Fabrication Process to Achieve Manufacturing Milestone

SAN JOSE, Calif., December 7, 2005IDT™ (Integrated Device Technology, Inc.; NASDAQ:  IDTI), the leading provider of network search engines (NSEs), today announced the industry’s first NSE manufactured on TSMC’s (Taiwan Semiconductor Manufacturing Company) 90 nanometer (nm) process technology. This next-generation IDT device, which is now sampling, achieves new levels of performance, cost and power consumption to further accelerate packet processing in enterprise switches and core/edge routers.

 

Utilizing cutting-edge process technology and innovative design techniques, the IDT next-generation NSE doubles core search performance while cutting power consumption in half and reducing package size by 30 percent.  In addition, because the TSMC 90 nm technology utilizes 300mm wafers for its manufacturing process, IDT achieves world-class economy of scale and efficient NSE production

 

“Our product development strategy incorporates the right mix of in-house manufacturing and outsourcing to leading facilities such as TSMC,” said Scott Sarnikowski, vice president and general manager for the IDT IP co-processor division.  “In this case, we are able to leverage our design expertise with TSMC’s intimate knowledge of the fabrication process to develop NSEs that provide new levels of performance to support the emergence of next-generation triple-play services such as IP TV and VoIP, as well as to provide more efficient processing of IPv6 traffic.” 

 

TSMC continues to accelerate the development of next-generation products based on leading-edge process technologies,” said Kenneth Kin, senior vice president of worldwide sales and service for TSMC.  “A successful union between fabrication facility and semiconductor provider relies on innovative and market-leading products that complement the latest developments in process technology.  As a consequence, IDT, the premier provider of NSEs, enables new levels of service and functionality in emerging communications networks.”

 

 

 

TSMC’s Nexsys 90nm is the only foundry process at that node to feature standard copper interconnects, low-k dielectrics, and 12-inch wafer production. The Nexsys 90nm process provides a 2-times gate density improvement, 35 percent faster speed, 60 percent improvement in active power savings and a 20 percent interconnect RC improvement compared to the company’s 0.13 micron process.

 
IDT Network Search Engine Solutions
 
IDT provides a comprehensive family of NSEs that accelerate packet processing and enable intelligent application management in next-generation networking equipment.  IDT is recognized by RHK, Inc. and IDC as the technology leader, and as the volume shipment leader of NSEs.  IDT offers the industry’s highest-performance NSE operating up to 250 MHz, and was the first vendor to introduce an NSE with an integrated LA-1 interface.  The IDT NSE portfolio includes a family of custom devices, as well as families of NSEs with high-performance interfaces for ASICs, and glue-less interfaces to leading network processors, to accelerate packet classification and forwarding in core, metro and access networks.  IDT is an Associate Member of the Intel® Communications Alliance (www.intel.com/go/ica). 

 

About IDT

IDT is a global leader in semiconductor solutions for advanced network services. IDT serves its customers by applying its advanced processing, timing and memory technologies to create flexible, highly integrated products that enhance the functionality and processing of networking, computing, and consumer equipment. IDT accelerates innovation with products such as network search engines (NSEs), flow-control management (FCM) ICs, standards-based serial switching and bridging devices, and leading timing solutions products. The IDT timing solutions portfolio now integrates technologies from IDT, ICS and Freescale, providing a comprehensive mix of devices for virtually any advanced electronics system. In addition, the company’s product mix consists of FIFOs, multi-ports, telecommunications, high-performance digital logic and high-speed SRAMs to meet the requirements of leading communications companies.

 

Headquartered in San Jose, Calif., the company employs approximately 2,900 people worldwide and has a wafer manufacturing facility in Oregon, an assembly and test facility in Malaysia, a test facility in Singapore, and design centers in China, Canada, and the United States.

 

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