IDT Announces Volume Sample Availability of DDR4 Register and Thermal Sensor for Next-generation Server Memory Modules
IDT Reinforces Leadership Position in Memory Interface Devices Designed for RDIMMs and LRDIMMs in New-generation High-performance Data Centers
SAN JOSE, Calif., September 11, 2012 – Integrated Device Technology, Inc. (IDT®) (NASDAQ: IDTI), the Analog and Digital Company™ delivering essential mixed-signal semiconductor solutions, today announced a DDR4 register and temperature sensor that meet the industry’s stringent performance requirements. The new products are designed to facilitate the next generation of DRAM modules, including both registered dual inline memory modules (RDIMMs) and load-reduced DIMMs (LRDIMMs), to enable advancements in server and storage sub-system performance, scalability and power efficiency.
The IDT 4RCD0124 DDR4 register supports faster data rates and lower operating voltages, and it incorporates the major features required by DDR4 server-class memory modules. These key features include advanced reliability, availability and serviceability (RAS) capabilities and support for high-density DRAM technologies, including three-dimensional DRAM stacking (3DS). It also supports sideband control of additional data buffers which, together with the register, form the basis for DDR4 LRDIMMs that enable a new level of speed-scalable memory density for virtualized computing and storage systems. DDR4 server memory modules will double the performance of the current generation of DDR3 memory modules with performance of up to 3200 MT/s while simultaneously reducing power by 35 percent or more.
The IDT TSE2004GB2 thermal sensor with integrated serial presence detect (SPD) leverages the low-power, high-precision thermal sensing technology developed by IDT and upgrades it with faster SM-Bus access up to 1 MHz and double the EEPROM memory density at 512 bytes. The device is fully backward-compatible with DDR3 systems and supports the current feature enhancements set forth by the Joint Electronic Device Engineering Council (JEDEC) for DDR4 systems.
According to Mike Howard, senior principal analyst, DRAM and memory, at IHS, the transition to DDR4 memory is expected to begin in earnest in 2014 and grow to nearly half of the overall market in 2015. The value of transitioning to DDR4 memory is particularly compelling in enterprise server and storage equipment, where memory footprints have grown significantly to keep pace with ever more powerful and integrated microprocessors.
“As the industry’s premier memory interface products supplier, our customers and ecosystem partners look to IDT to lead in all phases of the development of new technologies, from early standards development to product delivery,” said Mario Montana, vice president and general manager of the Enterprise Computing Division at IDT. “DDR4 memory modules utilizing IDT products deliver the scalability, performance, and power efficiency crucial for applications such as in-memory databases, virtualization, and cloud computing.”
Pricing and Availability
The IDT 4RCD0124 is currently sampling to qualified customers and is available in a 253-ball BGA package. The IDT TSE2004GB2 is also sampling and is available in an 8-pin VQFPN package. For more information, please contact IDT sales.
Integrated Device Technology, Inc., the Analog and Digital Company™, develops system-level solutions that optimize its customers’ applications. IDT uses its market leadership in timing, serial switching and interfaces, and adds analog and system expertise to provide complete application-optimized, mixed-signal solutions for the communications, computing and consumer segments. Headquartered in San Jose, Calif., IDT has design, manufacturing and sales facilities throughout the world. IDT stock is traded on the NASDAQ Global Select Stock Market® under the symbol “IDTI.” Additional information about IDT is accessible at www.IDT.com. Follow IDT on Facebook, LinkedIn, Twitter, and YouTube.
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