IDT Extends Leadership in PCI Express Gen2 System Interconnect Solutions
New Family of Devices Incorporates Industry’s Richest Feature Set for Multi-Root Systems for the Communications and Embedded Markets
SAN JOSE, Calif., February 9, 2010 — IDT® (Integrated Device Technology, Inc.; NASDAQ: IDTI), a leading provider of essential mixed signal semiconductor solutions that enrich the digital media experience, today announced a family of PCI Express® (PCIe®) Gen2 system interconnect switching solutions featuring the industry’s most-advanced switch architecture to support multi-domain data and control plane connectivity for multi-root communications and embedded applications. These new PCIe Gen2 solutions provide system architects with unprecedented levels of design flexibility for their multi-root systems, helping IDT customers improve their time to market
The new switching solutions, based on the IDT partitionable switch architecture, achieves this flexibility by allowing multiple PCIe domains and root complexes to be supported by a single monolithic device that enables dynamic assignment of PCIe slot and I/O peripherals for on-the-fly resource sharing and load balancing. Additionally, the new IDT architecture supports an unprecedented eight non-transparent bridging (NTB) functions to enable root complex isolation, failover support and inter-processor communication between PCIe domains.
This architecture also leverages the rich IDT silicon timing heritage to integrate the industry’s only PCIe switching solution providing multiple clock domain isolation, including support for multiple spread spectrum clocking (SSC) timing domains. With additional unique feature differentiation, including multicast capability within and across domains, two Direct Memory Access (DMA) functions and support for PCI eXtensions for Instrumentation (PXIe), the new IDT switch family provides unmatched support for multi-root communications in embedded systems.
“PCIe is moving beyond servers into embedded and communications systems, offering greater scalability, robustness and even broader applicability,” said Jag Bolaria, senior analyst with the Linley Group. “As PCIe expands it reach into multi-root communications and embedded applications, IDT is expanding its portfolio of devices to meet the needs of these emerging markets.”
The new family of PCIe Gen2 system interconnect switching solutions feature IDT Power Smart technology, demonstrating the company’s mixed signal design expertise enabling solutions to lower power consumption by as much as 35 percent over similarly configured switches. In addition, the new devices improve design flexibility offering a 70 percent reduction in the package size and required board space compared to alternate solutions with similar lane and port configurations.
“By closely working with strategic customers, IDT continues to provide solutions tailored for communication and embedded applications. We are pleased to build on our previous ‘firsts’ in PCIe switching such as partitionable switch architecture and support for multicast with our new architecture, which offers the most comprehensive solution for multi-root systems,” said Mario Montana, vice president and general manger for the IDT Enterprise Computing Division. “We believe our new architecture offers not only the richest set of features, but also the lowest power solution, offering our customers significant power and real estate savings.”
The new family is comprised of seven devices with system interconnect solutions targeting data- and services-plane traffic as well as control-plane traffic. Solutions for high-performance data traffic include a 32-lane and 8-port device, and a 24-lane, 6-port device. Devices for control-plane traffic include 32-, 24-, 16- and 12-lane devices with port counts of 24-, 16- and 12-port devices in various configurations.
Pricing and Availability
The new family of interconnect solutions is currently sampling will be generally available in 1Q 2010. Each device will have a dedicated evaluation and development kit for device testing and analysis, and system emulation. Each kit consists of a hardware evaluation board with representative upstream and downstream connectivity, and an IDT-developed, GUI-based software environment that enables the designer to tune system and device configurations to meet system requirements. The new IDT PCIe solutions range from $36.20 to $52.00 for 10,000 units and come in 19mm and 23mm Ball Gate Array (BGA) packages. For additional information, including pricing and specific sampling schedule, visit www.IDT.com/go/pciexpress.
IDT provides the broadest range of high performance, low power PCI Express switching and bridging solutions targeting system interconnect, I/O expansion and protocol bridging connectivity requirements. In addition, IDT is the leading PCI Express timing solutions provider. IDT is an active member of the PCI Express special interest group (SIG), and has strategic product plans based upon the standard.
With the goal of continuously improving the digital media experience, IDT integrates its fundamental semiconductor heritage with essential innovation, developing and delivering low-power, mixed signal solutions that solve customer problems. Headquartered in San Jose, Calif., IDT has design, manufacturing and sales facilities throughout the world. IDT stock is traded on the NASDAQ Global Select Stock Market® under the symbol “IDTI.” Additional information about IDT is accessible at www.IDT.com.
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