IDT Offers Leading Network Search Engines in RoHS-Compliant Flip-Chip Packaging
SAN JOSE, Calif., September 19, 2005 – IDT™ (Integrated Device Technology, Inc.; Nasdaq: IDTI), today announced it has begun volume production of its RoHS (Restriction on Hazardous Substances)-compliant flip-chip packaged monolithic 512Kx36 (18-Mbit) and 256Kx36 (9-Mbit) network search engines (NSEs) with dual Network Processor Forum (NPF) Look Aside (LA-1) interfaces. By offering these NSEs in RoHS-compliant flip-chip packaging, IDT is enabling designers of telecommunications equipment to reach line rate performance up to OC-192 and beyond, while at the same time meeting new environmental regulations regarding lead-free products.
“Last December, we announced 99 percent of our packages were RoHS compliant. Today, we are pleased to proclaim that our entire product portfolio is RoHS compliant,” said Anne Katz, vice president of worldwide assembly and test with IDT. “IDT believes it is globally essential for the semiconductor industry to provide environmentally safe components for electronics systems. Leveraging our extensive expertise in environmental compliance, coupled with our superior technical knowledge, we are able to offer our customers the best of both worlds — our superior network search engine technology in RoHS-compliant flip-chip packaging — enabling them to stay on the leading edge of performance in an environmentally responsible manner.”
About the IDT NSEs with Dual LA-1 Interfaces
Operating at 250 million searches per second (MSPS), the IDT 512Kx36 (75K72234) and 256Kx36 (75K62234) NSEs offer fully integrated LA-1 compliant interfaces to allow a seamless connection between the NSE and the network processing unit (NPU), including AMCC’s nP3700 NPUs and the IntelÒ IXP2400, IntelÒ IXP2800 and IntelÒ IXP2850 NPUs. Similar to existing devices within the IDT portfolio, the NSEs with dual LA-1 interfaces offer application-support features, such as dynamic database management for increased power savings and simultaneous multi-database lookup (SMDL), thereby enabling multiple packet searches up to 250 MSPS. For additional product information, visit the IDT Web site at http://www.IDT.com/?id=37.
IDT is among many companies participating in an industry-wide effort to develop lead-free solders and semiconductor packaging technologies. The goal is to create lead-free processes that are cost-effective and which maintain equivalent or improved levels of reliability. Soldering and plating technologies are used throughout the electronics industry, and leading manufacturers are addressing a range of issues relating to higher temperatures required for reflow and wave lead-free soldering. The efforts also include standard ways of evaluating product quality and reliability. Currently, the industry’s focus is on making semiconductor package terminals and solder-ball connections lead-free.
IDT Network Search Engine SolutionsIDT provides a comprehensive family of NSEs that accelerate packet processing and enable intelligent application management in next-generation networking equipment. The IDT NSE portfolio includes a family of custom devices, as well as families of NSEs with high-performance interfaces for ASICs, and glue-less interfaces to leading network processors, to accelerate packet classification and forwarding in core, metro and access networks. IDT serves as chairman of the board of the Network Processing Forum (www.npforum.org) and is an Associate Member of the Intel® Communications Alliance (www.intel.com/go/ica).
IDT is a global leader in semiconductor solutions for advanced network services. IDT serves communications equipment vendors by applying its advanced hardware, software and memory technologies to create flexible, highly integrated products that enhance the functionality and processing of network equipment. IDT accelerates innovation with products such as network search engines (NSEs), flow-control management (FCM) ICs and its commitment to and products for standards-based serial switching. The portfolio also comprises products optimized for communications applications, including telecom products, FIFOs, multi-ports, and timing solutions. In addition, the product mix includes high-performance digital logic and high-speed SRAMs to meet the requirements of leading communications companies.
Headquartered in San Jose, Calif., the company employs approximately 2,500 people worldwide and has a wafer manufacturing facility in Oregon, and an assembly and test facility in Malaysia. IDT stock is traded on the NASDAQ Stock Market® under the symbol “IDTI.” The company is included in the S&P 1000, which is a combination of the S&P MidCap 400 and S&P SmallCap 600 Indices, and is also part of the S&P SuperComposite 1500, which combines the S&P 500, MidCap 400, and SmallCap 600.
IDT and Interprise are trademarks of Integrated Device Technology, Inc. Other brands, product names and marks are trademarks, registered trademarks, or trade names of their respective owners.