| 種類 |
タイトル |
サイズ |
改訂日 |
| ホワイト・ペーパー |
Memory Solutions for Advancing Server Applications |
174 KB |
02/08/2007 |
| |
Green Semiconductor Packaging |
960 KB |
07/12/2006 |
| カタログ |
IDT Quick Reference Guide |
58 KB |
06/21/2006 |
| 製品の変更通知 |
PCN# A0702-01 Changed of Underfill Material for FCBGA-655 |
115 KB |
04/04/2007 |
| |
PCN# : A0609-01 Addition of SPIL, Taiwan as an Alternate Assembly Facility for AMB |
86 KB |
10/09/2006 |
| |
PCN# A-0607-05 Green Mold Compound KMC3580 for BGA |
195 KB |
08/30/2006 |
| |
PCN# : L-0607-01 MSL 3 to MSL 1 for ICS Classic Products |
305 KB |
08/03/2006 |
| |
PCN# : A-0607-02 IDT Penang as Alternate Assembly Facility for ICS CVBGA and FPBGA |
100 KB |
07/27/2006 |
| |
PCN# A-0605-01R1 Amkor Taiwan as Alternate Assembly and KYEC Taiwan as Alternate Test Facility for AMB Products |
88 KB |
07/18/2006 |
| |
PCN# : TB-0605-05 New Shipping Tray for CVBGA 52L & 56L |
1134 KB |
06/29/2006 |
| |
PCN# A-0602-04(R1) Alternate Assembly Location for 655L FCBGA |
86 KB |
06/21/2006 |
| |
PCN# : A-0605-05 AIT as Alternate Assembly Facility for SOIC/QSOP/SSOP/TSSOP/PDIP |
298 KB |
05/25/2006 |
| |
A-0605-01 AMKOR Taiwan as Alternate Assembly Facility for 655L FCBGA |
21 KB |
05/11/2006 |
| |
PCN# A-0601-01 AIT as Alternate Assembly Location |
281 KB |
03/21/2006 |
| |
PCN# A-0603-02 CARSEM as Alternate Assembly Location |
121 KB |
03/21/2006 |
製品ライン・ニュース
