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Product Number: 89HF08P08AG3ZBHLG

Carrier Type: TRAY

Pkg. Description: FLIP CHIP BGA 25 X 25 MM 0.8PITCH

Qty. per Carrier: 44

Pkg. Type: FCBGA

Pkg. Code: HLG900

Qty. per Reel: 350

Lead Count: 900

Reel Size: 13

Length: 25

Tape Pin 1 Quad: 1

Width: 25

Tape Pocket Pitch: 32

Thickness: 2.69

Moisture Sensitivity Level (MSL): 4

Lead Pitch:

Moisture Sensitivity Bake: 24

Pkg. Status: Active

Moisture Exposure Floor Life: 72hrs@<30C/60%R

Pkg. Class: PLASTIC

Re-bake Conditions: 48hrs@125C

Pkg. Category: G

Peak Reflow Temp: 245

Pb (Lead) Free: Yes

Pb Free Category: e1 SnAgCu

JEDEC Standard: