BLG1156 (FCBGA 1156)
Package Description
FLIP CHIP BGA 35 X 35 MM X 1.0MM PITCH
Package Status
Active
Package Type
FCBGA
Class
PLASTIC
Package Code
BLG1156
Category
G
Lead Count
1156
Pb (Lead) Free
Y
Length
35mm
Pb Free Category
e1 SnAgCu
Width
35mm
Thickness
2.82mm
Peak Reflow Temp
245°C
Pitch
1mm
Pkg. Dimensions
35.0 x 35.0 x 2.82
