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BR676 (FCBGA 676)

Package Description

FLIP CHIP BGA 27 X 27 MM 1.0 MM PITCH

Package Status

Active

Package Type

FCBGA

Class

PLASTIC

Package Code

BR676

Category

RoHS

Lead Count

676

Pb (Lead) Free

N

Length

27mm

Pb Free Category

e1 SnAgCu

Width

27mm

Thickness

3.4mm

Peak Reflow Temp

245°C

Pitch

1mm

Pkg. Dimensions

27.0 x 27.0 x 3.4

Documents

Title Typesort icon Format File Size Date
IDT User Recommended Reflow Profile (RoHS 245C) Reflow Profile PDF 86 KB 01/31/2008
BR676 IPC-1752-2 v1.01 Class 6 (MCD) Materials Composition Declaration PDF 1 KB 11/11/2008
BR676 IPC 1752-1 v1.01 Class 4 (MCD) Materials Composition Declaration PDF 533 KB 11/11/2008
Flip Chip RoHS ICP (SGS) reports Certificates / Reports PDF 294 KB 01/20/2010
Flip Chip Products RoHS Material Declaration Certificate Certificates / Reports PDF 43 KB 07/04/2008
BB/BBG 416, BB/BBR 456, BG/BGG 256/272, BH/BHG 388/479/580/675, BL/BLG/BR 479/672/676, BX/BXG/RX 420 & HM/RM 675/676 Shipping Tray (New Tray) Carrier/Package PDF 134 KB 06/15/2010
COVER TAPE (KOSTAT) Carrier / Package Type PDF 81 KB 11/22/2012
BL/BR/BLG 576 PACKAGE OUTLINE 25.0 x 25.0 mm BODY 1.00 mm BALLPITCH FCBGA Carrier / Package Type PDF 189 KB 05/02/2008
BL/BR/BLG 676 PACKAGE OUTLINE 27 X 27 MM BODY 1.0 MM PITCH FCBGA Carrier / Package Type PDF 63 KB 05/05/2008
BL/BLG 676, BR 672/676, BT/BTG 576 & HL/HLG/HR 676 CARRIER TAPE (PCT) Carrier / Package Type PDF 67 KB 09/28/2012