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BR784 (FCBGA 784)

Package Description

FLIP CHIP BGA 29 X 29 MM 1.0 MM PITCH

Package Status

Active

Package Type

FCBGA

Class

PLASTIC

Package Code

BR784

Category

RoHS

Lead Count

784

Pb (Lead) Free

N

Length

29mm

Pb Free Category

e1 SnAgCu

Width

29mm

Thickness

3.2mm

Peak Reflow Temp

245°C

Pitch

1mm

Pkg. Dimensions

29.0 x 29.0 x 3.2

Documents

Title Typesort icon Format File Size Date
BR 784 & HM/RM 784 CARRIER TAPE (PCT) Carrier / Package Type PDF 66 KB 12/02/2012
COVER TAPE (KOSTAT) Carrier / Package Type PDF 81 KB 11/22/2012
BL/BR 784 PACKAGE OUTLINE 29.0 X 29.0 MM BODY 1.0 MM PITCH FCBGA Carrier / Package Type PDF 128 KB 02/10/2009
BL/BR 784 PACKAGE OUTLINE FCBGA 29.0 x 29.0 mm, 1.0 mm PITCH-FLAT-LID- Carrier / Package Type PDF 83 KB 10/12/2011
BL/BLG/BR 784, BS/BSG 272, HM 784 & RM 784 Shipping Tray Carrier/Package PDF 111 KB 06/15/2010
Flip Chip RoHS ICP (SGS) reports Certificates / Reports PDF 294 KB 01/20/2010
Flip Chip Products RoHS Material Declaration Certificate Certificates / Reports PDF 43 KB 07/04/2008
BR784 IPC-1752-2 v1.01 Class 6 (MCD) Materials Composition Declaration PDF 1 KB 07/24/2009
BR784 IPC 1752-1 v1.01 Class 4 (MCD) Materials Composition Declaration PDF 1 KB 07/24/2009
IDT User Recommended Reflow Profile (RoHS 245C) Reflow Profile PDF 86 KB 01/31/2008