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HL676 (FCBGA 676)

Package Description

FLIP CHIP BGA 27 X 27 MM 1.0 MM PITCH

Package Status

Active

Package Type

FCBGA

Class

PLASTIC

Package Code

HL676

Category

260

Lead Count

676

Pb (Lead) Free

No

Length

27mm

Pb Free Category

e0

Width

27mm

Thickness

3.2mm

Peak Reflow Temp

225°C

Pitch

1mm

Pkg. Dimensions

27.0 x 27.0 x 3.2

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