HL676 (FCBGA 676)
Package Description
FLIP CHIP BGA 27 X 27 MM 1.0 MM PITCH
Package Status
Active
Package Type
FCBGA
Class
PLASTIC
Package Code
HL676
Category
260
Lead Count
676
Pb (Lead) Free
No
Length
27mm
Pb Free Category
e0
Width
27mm
Thickness
3.2mm
Peak Reflow Temp
225°C
Pitch
1mm
Pkg. Dimensions
27.0 x 27.0 x 3.2
