HL900 (FCBGA 900)
Package Description
FLIP CHIP BGA 25 X 25 MM 0.8PITCH
Package Status
Active
Package Type
FCBGA
Class
PLASTIC
Package Code
HL900
Category
240
Lead Count
900
Pb (Lead) Free
No
Length
25mm
Width
25mm
Thickness
2.69mm
Peak Reflow Temp
225°C
Pitch
0.8mm
Pkg. Dimensions
25.0 x 25.0 x 2.69
