HLG484 (FCBGA 484)
Package Description
FLIP CHIP BGA 23 X 23MM 1.0 MM PITCH
Package Status
Active
Package Type
FCBGA
Class
PLASTIC
Package Code
HLG484
Category
G
Lead Count
484
Pb (Lead) Free
Y
Length
23mm
Pb Free Category
e1 SnAgCu
Width
23mm
Thickness
2.92mm
Peak Reflow Temp
250°C
Pitch
1mm
Pkg. Dimensions
23.0 x 23.0 x 2.92
