Skip to main content

HLG676 (FCBGA 676)

Package Description

FLIP CHIP BGA 27 X 27 MM 1.0 MM PITCH

Package Status

Active

Package Type

FCBGA

Class

PLASTIC

Package Code

HLG676

Category

G

Lead Count

676

Pb (Lead) Free

Yes

Length

27mm

Pb Free Category

e1 SnAgCu

Width

27mm

Thickness

3.2mm

Peak Reflow Temp

260°C

Pitch

1mm

Pkg. Dimensions

27.0 x 27.0 x 3.2