HLG676 (FCBGA 676)
Package Description
FLIP CHIP BGA 27 X 27 MM 1.0 MM PITCH
Package Status
Active
Package Type
FCBGA
Class
PLASTIC
Package Code
HLG676
Category
G
Lead Count
676
Pb (Lead) Free
Y
Length
27mm
Pb Free Category
e1 SnAgCu
Width
27mm
Thickness
3.2mm
Peak Reflow Temp
260°C
Pitch
1mm
Pkg. Dimensions
27.0 x 27.0 x 3.2
