HLG900 (FCBGA 900)
Package Description
FLIP CHIP BGA 25 X 25 MM 0.8PITCH
Package Status
Active
Package Type
FCBGA
Class
PLASTIC
Package Code
HLG900
Category
G
Lead Count
900
Pb (Lead) Free
Yes
Length
25mm
Pb Free Category
e1 SnAgCu
Width
25mm
Thickness
2.69mm
Peak Reflow Temp
245°C
Pitch
0.8mm
Pkg. Dimensions
25.0 x 25.0 x 2.69
