HM675 (FCBGA 675)
Package Description
FLIP CHIP BGA 27 X 27 MM 1.0 MM PITCH
Package Status
Active
Package Type
FCBGA
Class
PLASTIC
Package Code
HM675
Category
240
Lead Count
675
Pb (Lead) Free
N
Length
27mm
Pb Free Category
e0
Width
27mm
Thickness
2.41mm
Peak Reflow Temp
225°C
Pitch
1mm
Pkg. Dimensions
27.0 x 27.0 x 2.41
