HM675 (FCBGA 675)
Package Description
FLIP CHIP BGA 27 X 27 MM 1.0 MM PITCH
Package Status
Active
Package Type
FCBGA
Class
PLASTIC
Package Code
HM675
Category
240
Lead Count
675
Pb (Lead) Free
No
Length
27mm
Pb Free Category
e0
Width
27mm
Thickness
2.41mm
Peak Reflow Temp
225°C
Pitch
1mm
Pkg. Dimensions
27.0 x 27.0 x 2.41
