HM784 (FCBGA 784)
Package Description
FLIP CHIP BGA 29 X 29 MM 1.0 MM PITCH
Package Status
Active
Package Type
FCBGA
Class
PLASTIC
Package Code
HM784
Category
240
Lead Count
784
Pb (Lead) Free
No
Length
29mm
Pb Free Category
e0
Width
29mm
Thickness
2.75mm
Peak Reflow Temp
225°C
Pitch
1mm
Pkg. Dimensions
29.0 x 29.0 x 2.75
