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RM576 (FCBGA 576)

Package Description

FLIP CHIP BGA 25 X 25 MM 1.0 MM PITCH

Package Status

Active

Package Type

FCBGA

Class

PLASTIC

Package Code

RM576

Category

RoHS

Lead Count

576

Pb (Lead) Free

N

Length

25mm

Pb Free Category

e1 SnAgCu

Width

25mm

Thickness

2.6mm

Peak Reflow Temp

245°C

Pitch

1mm

Pkg. Dimensions

25.0 x 25.0 x 2.6

Documents

Titlesort icon Type Format File Size Date
RM576 IPC-1752-2 v1.01 Class 6 (MCD) Materials Composition Declaration PDF 291 KB 02/16/2011
RM576 IPC 1752-1 v1.01 Class 4 (MCD) Materials Composition Declaration PDF 250 KB 02/16/2011
PCN# : TB0803-01 Change of HIC Card Product Change Notification PDF 967 KB 05/08/2008
IDT User Recommended Reflow Profile (RoHS 245C) Reflow Profile PDF 86 KB 01/31/2008
HM/RM 576 PACKAGE OUTLINE FCBGA 25.0 x 25.0 mm, 1.0 mm PITCH DIZE SIZE: 9.82 x 10.4 mm Carrier / Package Type PDF 101 KB 01/05/2011
Flip Chip RoHS ICP (SGS) reports Certificates / Reports PDF 294 KB 01/20/2010
Flip Chip Products RoHS Material Declaration Certificate Certificates / Reports PDF 43 KB 07/04/2008
COVER TAPE (KOSTAT) Carrier / Package Type PDF 81 KB 11/22/2012
BT/BX/BXG/RX 320 & BM/BMG/RM 576 Shipping Tray Carrier/Package PDF 150 KB 09/11/2006
BM/RM 576 PACKAGE OUTLINE 25.0 X 25.0 mm BODY 1.0 mm PITCH FCBGA Carrier / Package Type PDF 172 KB 10/20/2005
AN/ANG/BN/BNG/MN/RN 360, BM/BMG/HM/RM 576, BT/BTG 320, BX/BXG 320 & BL/BLG/BR 576 Shipping Tray (New Tray) Carrier/Package PDF 125 KB 12/29/2010