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RM675 (FCBGA 675)

Package Description

FLIP CHIP BGA 27 X 27 MM 1.0 MM PITCH

Package Status

Active

Package Type

FCBGA

Class

PLASTIC

Package Code

RM675

Category

RoHS

Lead Count

675

Pb (Lead) Free

N

Length

27mm

Pb Free Category

e1 SnAgCu

Width

27mm

Thickness

2.41mm

Peak Reflow Temp

260°C

Pitch

1mm

Pkg. Dimensions

27.0 x 27.0 x 2.41

Documents

Title Type Format File Size Datesort icon
HM/RM 675 PACKAGE OUTLINE 27 x 27 mm BODY 1.00 mm PITCH FCBGA Carrier / Package Type PDF 176 KB 08/19/2009
RM675 IPC-1752-2 v1.1 Class 6 (MCD) Materials Composition Declaration PDF 293 KB 09/07/2009
RM675 IPC 1752-1 v1.1 Class 4 (MCD) Materials Composition Declaration PDF 250 KB 09/07/2009
BB/BBG 416, BB/BBR 456, BG/BGG 256/272, BH/BHG 388/479/580/675, BL/BLG/BR 479/672/676, BX/BXG/RX 420 & HM/RM 675/676 Shipping Tray (New Tray) Carrier/Package PDF 134 KB 06/15/2010
HL/HLG 1020 SHIPPING TRAY Carrier / Package Type PDF 122 KB 09/19/2012