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RM784 (FCBGA 784)

Package Description

FLIP CHIP BGA 29 X 29 MM 1.0 MM PITCH

Package Status

Active

Package Type

FCBGA

Class

PLASTIC

Package Code

RM784

Category

RoHS

Lead Count

784

Pb (Lead) Free

N

Length

29mm

Pb Free Category

e1 SnAgCu

Width

29mm

Thickness

2.75mm

Peak Reflow Temp

250°C

Pitch

1mm

Pkg. Dimensions

29.0 x 29.0 x 2.75

Documents

Title Typesort icon Format File Size Date
BR 784 & HM/RM 784 CARRIER TAPE (PCT) Carrier / Package Type PDF 66 KB 12/02/2012
COVER TAPE (KOSTAT) Carrier / Package Type PDF 81 KB 11/22/2012
HM/RM 784 PACKAGE OUTLINE 29.0 x 29.0 mm BODY 1.00 mm PITCH die size: 9.82 mm x 10.4 mm Carrier / Package Type PDF 120 KB 10/14/2010
BL/BLG/BR 784, BS/BSG 272, HM 784 & RM 784 Shipping Tray Carrier/Package PDF 111 KB 06/15/2010
RM784 IPC 1752-1 v1.1 Class 4 (MCD) Materials Composition Declaration PDF 250 KB 01/27/2011
RM784 IPC-1752-2 v1.1 Class 6 (MCD) Materials Composition Declaration PDF 335 KB 01/27/2011