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RM784 (FCBGA 784)

Package Description

FLIP CHIP BGA 29 X 29 MM 1.0 MM PITCH

Package Status

Active

Package Type

FCBGA

Class

PLASTIC

Package Code

RM784

Category

RoHS

Lead Count

784

Pb (Lead) Free

No

Length

29mm

Pb Free Category

e1 SnAgCu

Width

29mm

Thickness

2.75mm

Peak Reflow Temp

250°C

Pitch

1mm

Pkg. Dimensions

29.0 x 29.0 x 2.75

Documents

Title Typesort icon Format File Size Date
HM/RM 784 PACKAGE OUTLINE 29.0 x 29.0 mm BODY 1.00 mm PITCH die size: 9.82 mm x 10.4 mm Carrier / Package Type PDF 120 KB 10/14/2010
Quadrant 1 Loading Orientation in Reel form Carrier / Package Type PDF 203 KB 04/10/2013
BS/BSG 272, HM 784 & RM 784 SHIPPING TRAY Carrier / Package Type PDF 112 KB 01/21/2013
BR 784 & HM/RM 784 CARRIER TAPE (PCT) Carrier / Package Type PDF 66 KB 12/02/2012
COVER TAPE (KOSTAT) Carrier / Package Type PDF 81 KB 11/22/2012
RM784 IPC 1752-1 v1.1 Class 4 (MCD) Materials Composition Declaration PDF 250 KB 01/27/2011
RM784 IPC-1752-2 v1.1 Class 6 (MCD) Materials Composition Declaration PDF 335 KB 01/27/2011