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BF208 (CABGA 208)

Package Description

CHIP ARRAY BGA 15.0 X 15.0 MM X 0.8 MM P

Package Status

Active

Package Type

CABGA

Class

PLASTIC

Package Code

BF208

Category

240

Lead Count

208

Pb (Lead) Free

No

Length

15mm

Pb Free Category

e0

Width

15mm

Thickness

1.4mm

Peak Reflow Temp

225°C

Pitch

0.8mm

Pkg. Dimensions

15 x 15 x 1.4

Documents

Title Typesort icon Format File Size Date
BC/BCG 196 & BF/BFG 208/289 SHIPPING TRAY Carrier / Package Type PDF 105 KB May 22, 2016
COVER TAPE Carrier / Package Type PDF 26 KB Nov 12, 2015
Quadrant 1 Loading Orientation in Reel form Carrier / Package Type PDF 137 KB Sep 10, 2015
BF208 IPC-1752-2 v1.1 Class 6 (MCD) Materials Composition Declaration PDF 258 KB Aug 26, 2009
BF208 IPC 1752-1 v1.1 Class 4 (MCD) Materials Composition Declaration PDF 250 KB Aug 26, 2009
BF/BFG PACKAGE OUTLINE 15.0 X 15.0 MM BODY FPBGA Package Outline Drawing PDF 196 KB Jun 12, 2013
PCN# : A0704-02 New Die Attach Material for CABGA-256, FPBGA-96/208, CVBGA-52/56, PBGA-119/272/416 Product Change Notification PDF 177 KB Sep 18, 2007
PCN# A-0607-05 Green Mold Compound KMC3580 for BGA Product Change Notification PDF 194 KB Aug 30, 2006
PCN# : A-0610-02 ASAT China as Alternate Facility for CABGA/CVBGA/FPBGA/TQFP/PQFP Product Change Notification PDF 252 KB Oct 19, 2006
PCN# A-0601-01 AIT as Alternate Assembly Location Product Change Notification PDF 281 KB Mar 21, 2006
IDT User Recommended Reflow Profile (Standard 225C) Reflow Profile PDF 94 KB Jan 31, 2008