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BFG114 (CABGA 114)

Package Description

CHIP ARRAY BGA 5.5 X 16.0 MM X 0.8 MM PI

Package Status

Active

Package Type

CABGA

Class

PLASTIC

Package Code

BFG114

Category

G

Lead Count

114

Pb (Lead) Free

Yes

Length

16mm

Pb Free Category

e1 SnAgCu

Width

5.5mm

Thickness

1.4mm

Peak Reflow Temp

260°C

Pitch

0.8mm

Pkg. Dimensions

16 x 5.5 x 1.4

Documents

Title Typesort icon Format File Size Date
BF/BFG 114 SHIPPING TRAY Carrier / Package Type PDF 207 KB Jan 14, 2013
COVER TAPE Carrier / Package Type PDF 26 KB Nov 12, 2015
Quadrant 1 Loading Orientation in Reel form Carrier / Package Type PDF 137 KB Sep 10, 2015
Green Products RoHS Material Declaration Certificate Certificates / Reports PDF 95 KB Mar 11, 2013
BFG114 IPC-1752-2 v1.01 Class 6 (MCD) Materials Composition Declaration PDF 1 KB Dec 9, 2007
BFG114 IPC 1752-1 v1.01 Class 4 (MCD) Materials Composition Declaration PDF 1 KB Dec 9, 2007
BF/BFG PACKAGE OUTLINE 5.50 mm BODY WIDTH .80 mm BALL PITCH FPBGA Package Outline Drawing PDF 300 KB Jun 24, 2013
PCN# : A-0610-02 ASAT China as Alternate Facility for CABGA/CVBGA/FPBGA/TQFP/PQFP Product Change Notification PDF 252 KB Oct 19, 2006
IDT User Recommended Reflow Profile (Pb-Free 260C) Reflow Profile PDF 85 KB Jan 31, 2008