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BFG324 (CABGA 324)

Package Description

CHIP ARRAY BGA 15MM X 15MM X 0.8MM PITCH

Package Status

Active

Package Type

CABGA

Class

PLASTIC

Package Code

BFG324

Category

G

Lead Count

324

Pb (Lead) Free

Yes

Length

15mm

Pb Free Category

e1 SnAgCu

Width

15mm

Thickness

1.7mm

Peak Reflow Temp

260°C

Pitch

0.8mm

Pkg. Dimensions

15 x 15 x 1.7

Documents

Title Typesort icon Format File Size Date
COVER TAPE Carrier / Package Type PDF 26 KB Nov 12, 2015
Quadrant 1 Loading Orientation in Reel form Carrier / Package Type PDF 137 KB Sep 10, 2015
Green Products RoHS Material Declaration Certificate Certificates / Reports PDF 95 KB Mar 11, 2013
BFG324 Copper Wire IPC-1752-2 v1.1 Class 6 (MCD) Materials Composition Declaration PDF 298 KB Sep 23, 2009
BFG324 Copper Wire IPC-1752-1 v1.1 Class 4 (MCD) Materials Composition Declaration PDF 250 KB Sep 23, 2009
BFG324 IPC 1752-1 v1.1 Class 4 (MCD) Materials Composition Declaration PDF 249 KB Sep 23, 2009
BFG324 IPC-1752-2 v1.1 Class 6 (MCD) Materials Composition Declaration PDF 298 KB Sep 23, 2009
BF/BFG324 PACKAGE OUTLINE 15.0 x 15.0 mm, 0.8 mm PITCH FPBGA Package Outline Drawing PDF 242 KB Jun 19, 2013
PCN# : A1004-04 Add ATP & ASEK as Alternate Assembly for 15.0mm x 15.0mm FPBGA-324 Product Change Notification PDF 86 KB Jul 21, 2010