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BL1156 (FCBGA 1156)

Package Description

FLIP CHIP BGA 35 X 35 MM X 1.0MM PITCH

Package Status

Active

Package Type

FCBGA

Class

PLASTIC

Package Code

BL1156

Category

240

Lead Count

1156

Pb (Lead) Free

No

Length

35mm

Pb Free Category

e0

Width

35mm

Thickness

2.82mm

Peak Reflow Temp

225°C

Pitch

1mm

Pkg. Dimensions

35 x 35 x 2.82

Documents

Title Typesort icon Format File Size Date
BL/BLG/BR 472/616/900/960/1156 & BM/MR 784 SHIPPING TRAY Carrier / Package Type PDF 138 KB Jan 28, 2013
BL1156 IPC 1752-1 v1.01 Class 4 (MCD) Materials Composition Declaration PDF 517 KB Dec 21, 2007
BL1156 IPC-1752-2 v1.01 Class 6 (MCD) Materials Composition Declaration PDF 285 KB Jul 9, 2012
BL/BR PACKAGE OUTLINE (35.0 x 35.0 mm Body; 1.0 mm Pitch; FCBGA) Package Outline Drawing PDF 737 KB Jun 19, 2013
IDT User Recommended Reflow Profile (Standard 225C) Reflow Profile PDF 94 KB Jan 31, 2008