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BQ165 (CABGA 165)

Package Description

CHIP ARRAY BGA 13.0 X 15.0 MM X 1.0 MM P

Package Status

Active

Package Type

CABGA

Class

PLASTIC

Package Code

BQ165

Category

240

Lead Count

165

Pb (Lead) Free

No

Length

15mm

Pb Free Category

e0

Width

13mm

Thickness

1.2mm

Peak Reflow Temp

225°C

Pitch

1mm

Pkg. Dimensions

15 x 13 x 1.2

Documents

Title Typesort icon Format File Size Date
BQ/BQG 165 CARRIER TAPE Carrier / Package Type PDF 23 KB Mar 8, 2016
COVER TAPE Carrier / Package Type PDF 26 KB Nov 12, 2015
Quadrant 1 Loading Orientation in Reel form Carrier / Package Type PDF 137 KB Sep 10, 2015
BQ/BQG 165 SHIPPING TRAY Carrier / Package Type PDF 164 KB Jan 21, 2013
BQ165 IPC-1752-2 v1.1 Class 6 (MCD) Materials Composition Declaration PDF 287 KB Aug 8, 2010
BQ165 IPC 1752-1 v1.01 Class 4 (MCD) Materials Composition Declaration PDF 529 KB Nov 5, 2008
BQ PACKAGE OUTLINE 13.0 X 15.0 MM BODY FPBGA Package Outline Drawing PDF 170 KB Jun 12, 2013
PCN# : A0705-02 New Mold Compound for CABGA-256, FPBGA-48, FPBGA-165 Product Change Notification PDF 138 KB Jul 25, 2007
IDT User Recommended Reflow Profile (Standard 225C) Reflow Profile PDF 94 KB Jan 31, 2008