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BQG165 (CABGA 165)

Package Description

CHIP ARRAY BGA 13.0 X 15.0 MM X 1.0 MM P

Package Status

Active

Package Type

CABGA

Class

PLASTIC

Package Code

BQG165

Category

G

Lead Count

165

Pb (Lead) Free

Yes

Length

15mm

Pb Free Category

e1 SnAgCu

Width

13mm

Thickness

1.2mm

Peak Reflow Temp

260°C

Pitch

1mm

Pkg. Dimensions

15 x 13 x 1.2

Documents

Title Typesort icon Format File Size Date
BQ/BQG 165 CARRIER TAPE Carrier / Package Type PDF 23 KB Mar 8, 2016
COVER TAPE Carrier / Package Type PDF 26 KB Nov 12, 2015
Quadrant 1 Loading Orientation in Reel form Carrier / Package Type PDF 137 KB Sep 10, 2015
BQ/BQG 165 SHIPPING TRAY Carrier / Package Type PDF 164 KB Jan 21, 2013
Green Products RoHS Material Declaration Certificate Certificates / Reports PDF 95 KB Mar 11, 2013
BQG165 IPC 1752-1 v1.01 Class 4 (MCD) Materials Composition Declaration PDF 528 KB Nov 5, 2008
BQG165 IPC-1752-2 v1.1 Class 6 (MCD) Materials Composition Declaration PDF 289 KB Aug 8, 2010
BQ PACKAGE OUTLINE 13.0 X 15.0 MM BODY FPBGA Package Outline Drawing PDF 170 KB Jun 12, 2013
PCN# : A0705-02 New Mold Compound for CABGA-256, FPBGA-48, FPBGA-165 Product Change Notification PDF 138 KB Jul 25, 2007
IDT User Recommended Reflow Profile (Pb-Free 260C) Reflow Profile PDF 85 KB Jan 31, 2008