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HLG400 (FCBGA 400)

Package Description

FLIP CHIP BGA 21X21 MM X 1.0 MM PITCH

Package Status

Active

Package Type

FCBGA

Class

PLASTIC

Package Code

HLG400

Category

G

Lead Count

400

Pb (Lead) Free

Yes

Length

21mm

Pb Free Category

e1 SnAgCu

Width

21mm

Thickness

3.34mm

Peak Reflow Temp

245°C

Pitch

1mm

Pkg. Dimensions

21 x 21 x 3.34

Documents

Title Typesort icon Format File Size Date
HL/HLG/HR 400 CARRIER TAPE Carrier / Package Type PDF 31 KB Mar 16, 2016
Quadrant 1 Loading Orientation in Reel form Carrier / Package Type PDF 137 KB Sep 10, 2015