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HM675 (FCBGA 675)

Package Description

FLIP CHIP BGA 27 X 27 MM 1.0 MM PITCH

Package Status

Active

Package Type

FCBGA

Class

PLASTIC

Package Code

HM675

Category

240

Lead Count

675

Pb (Lead) Free

No

Length

27mm

Pb Free Category

e0

Width

27mm

Thickness

2.41mm

Peak Reflow Temp

225°C

Pitch

1mm

Pkg. Dimensions

27 x 27 x 2.41

Documents

Title Typesort icon Format File Size Date
COVER TAPE Carrier / Package Type PDF 26 KB Nov 12, 2015
BB/BBG 416, BB/BBR 456, BG/BGG 256/272, BH/BHG 388/479/675, BL/BLG/BR 479/672/676, BX/BXG/RX 420, HL/HLG/HR 676 & HM/RM 675/676 SHIPPING TRAY Carrier / Package Type PDF 129 KB Jan 28, 2013
HM675 IPC 1752-1 v1.1 Class 4 (MCD) Materials Composition Declaration PDF 250 KB Sep 7, 2009
HM675 IPC-1752-2 v1.1 Class 6 (MCD) Materials Composition Declaration PDF 290 KB Sep 7, 2009
HM/RM 675 PACKAGE OUTLINE 27 x 27 mm BODY 1.00 mm PITCH FCBGA Package Outline Drawing PDF 447 KB Jun 17, 2013