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HMG324 (FCBGA 324)

Package Description

FLIP CHIP BGA 19.0 X 19.0 MM X 1.0 MM

Package Status

Active

Package Type

FCBGA

Class

PLASTIC

Package Code

HMG324

Category

RoHS

Lead Count

324

Pb (Lead) Free

No

Length

19mm

Pb Free Category

e1 SnAgCu

Width

19mm

Thickness

3.42mm

Peak Reflow Temp

245°C

Pitch

1mm

Pkg. Dimensions

19 x 19 x 3.42

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