HMG324 (FCBGA 324)

Title Information
Package Description FLIP CHIP BGA 19.0 X 19.0 MM X 1.0 MM
Package Status Active
Package Type FCBGA
Class PLASTIC
Package Code HMG324
Category RoHS
Lead Count 324
Pb (Lead) Free No
Length 19mm
Pb Free Category e1 SnAgCu
Width 19mm
Thickness 3.4mm
Peak Reflow Temp 245.00°C
Pitch 1.0mm
Package Non-Reel Carrier TRAY
Pkg. Dimensions 19 x 19 x 3.42