HMG675 (FCBGA 675)

Title Information
Package Description FLIP CHIP BGA 27 X 27 MM 1.0 MM PITCH
Package Status Active
Package Type FCBGA
Class PLASTIC
Package Code HMG675
Category G
Lead Count 675
Pb (Lead) Free Yes
Length 27mm
Pb Free Category e1 SnAgCu
Width 27mm
Thickness 2.41mm
Peak Reflow Temp 245.00°C
Pitch 1mm
Package Non-Reel Carrier TRAY
Pkg. Dimensions 27 x 27 x 2.41

Documentation