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HMG675 (FCBGA 675)

Package Description

FLIP CHIP BGA 27 X 27 MM 1.0 MM PITCH

Package Status

Active

Package Type

FCBGA

Class

PLASTIC

Package Code

HMG675

Category

G

Lead Count

675

Pb (Lead) Free

Yes

Length

27mm

Pb Free Category

e1 SnAgCu

Width

27mm

Thickness

2.41mm

Peak Reflow Temp

245°C

Pitch

1mm

Pkg. Dimensions

27 x 27 x 2.41

Documents

Title Typesort icon Format File Size Date
COVER TAPE Carrier / Package Type PDF 26 KB Nov 12, 2015