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PG14 (TSSOP 14)

Package Description

TSSOP 4.4 MM 0.65MM PITCH

Package Status

Active

Package Type

TSSOP

Class

PLASTIC

Package Code

PG14

Category

240

Lead Count

14

Pb (Lead) Free

No

Length

5mm

Pb Free Category

e0

Width

4.4mm

Thickness

1mm

Peak Reflow Temp

240°C

Pitch

0.65mm

Pkg. Dimensions

5 x 4.4 x 1

Documents

Title Typesort icon Format File Size Date
EN/ENG 16, EJ/EJG 20/24, PF/PFG, PG/PGG 14/16/20/24/28 SHIPPING TUBE Carrier / Package Type PDF 26 KB Dec 13, 2015
PG/PGG 14/16 CARRIER TAPE Carrier / Package Type PDF 28 KB Nov 15, 2015
COVER TAPE Carrier / Package Type PDF 26 KB Nov 12, 2015
Quadrant 1 Loading Orientation in Reel form Carrier / Package Type PDF 137 KB Sep 10, 2015
PG/PGG PACKAGE OUTLINE 4.4 MM BODY WIDTH TSSOP .65 MM LEAD PITCH Carrier / Package Type PDF 176 KB Mar 8, 2013
PG14 IPC-1752-2 v1.01 Class 6 (MCD) Materials Composition Declaration PDF 776 KB Sep 23, 2008
PG14 IPC 1752-1 v1.01 Class 4 (MCD) Materials Composition Declaration PDF 528 KB Sep 23, 2008
PG/PGG PACKAGE OUTLINE 4.4 MM BODY WIDTH TSSOP .65 MM LEAD PITCH Package Outline Drawing PDF 117 KB Oct 2, 2014
PGG14 PACKAGE OUTLINE 4.4mm TSSOP Package Outline Drawing PDF 30 KB May 2, 2016
PCN# L-0607-01R1 MSL 3 to MSL 1 for ICS Classic Products Product Change Notification PDF 379 KB Oct 6, 2006
PCN# : A0704-01 (R1) UNISEM Malaysia as Alternate Assembly Facility Product Change Notification PDF 490 KB Oct 5, 2007
PCN# : L-0607-01 MSL 3 to MSL 1 for ICS Classic Products Product Change Notification PDF 305 KB Aug 3, 2006
PCN# : A-0605-05 AIT as Alternate Assembly Facility for SOIC/QSOP/SSOP/TSSOP/PDIP Product Change Notification PDF 298 KB May 25, 2006
PCN# : A0807-02 Copper Bond Wire for SSOP, SOIC and TSSOP Product Change Notification PDF 147 KB Jul 30, 2008
IDT User Recommended Reflow Profile (Standard 240C) Reflow Profile PDF 85 KB Jan 31, 2008
IDT User Recommended Reflow Profile (RoHS 245C) Reflow Profile PDF 86 KB Jan 31, 2008