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PY28 (SSOP 28)

Package Description

SSOP 5.3 MM

Package Status

Active

Package Type

SSOP

Class

PLASTIC

Package Code

PY28

Category

240

Lead Count

28

Pb (Lead) Free

No

Length

10.2mm

Pb Free Category

e0

Width

5.3mm

Thickness

1.73mm

Peak Reflow Temp

240°C

Pitch

0.65mm

Pkg. Dimensions

10.2 x 5.3 x 1.73

Documents

Title Typesort icon Format File Size Date
PY/PYG SHIPPING TUBE Carrier / Package Type PDF 24 KB Dec 13, 2015
COVER TAPE Carrier / Package Type PDF 26 KB Nov 12, 2015
PY/PYG 28 CARRIER TAPE Carrier / Package Type PDF 31 KB Oct 29, 2015
PY/PYG 28 CARRIER TAPE Carrier / Package Type PDF 27 KB Oct 29, 2015
Quadrant 1 Loading Orientation in Reel form Carrier / Package Type PDF 137 KB Sep 10, 2015
PY/PYG PACKAGE OUTLINE (PY OR PV TOPMARK CODE) 5.3 mm BODY WIDTH SSOP .65 mm PITCH Carrier / Package Type PDF 162 KB Jan 11, 2013
PY28 IPC-1752-2 v1.1 Class 6 (MCD) Materials Composition Declaration PDF 292 KB Aug 8, 2010
PY28 IPC 1752-1 v1.1 Class 4 (MCD) Materials Composition Declaration PDF 249 KB Apr 13, 2009
PYG28 PACKAGE OUTLINE 5.3mm SSOP Package Outline Drawing PDF 33 KB May 2, 2016
PY/PYG PACKAGE OUTLINE (PY OR PV TOPMARK CODE) 5.3 mm BODY WIDTH SSOP .65 mm PITCH Package Outline Drawing PDF 162 KB Mar 18, 2013
PCN# : A-0605-05 AIT as Alternate Assembly Facility for SOIC/QSOP/SSOP/TSSOP/PDIP Product Change Notification PDF 298 KB May 25, 2006
PCN# : A1205-01 Product Change Notification PDF 114 KB Aug 16, 2012
PCN# : A0706-02 Add Chantworld-Taiwan as Alternate Assembly Facility Product Change Notification PDF 273 KB Aug 21, 2007
PCN# : A0704-01 (R1) UNISEM Malaysia as Alternate Assembly Facility Product Change Notification PDF 490 KB Oct 5, 2007
IDT User Recommended Reflow Profile (RoHS 245C) Reflow Profile PDF 86 KB Jan 31, 2008
IDT User Recommended Reflow Profile (Standard 240C) Reflow Profile PDF 85 KB Jan 31, 2008