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RJ655 (FCBGA 655)

Package Description

FLIP CHIP BGA 24.5 X 19.5 MM 0.80 MM PIT

Package Status

Active

Package Type

FCBGA

Class

PLASTIC

Package Code

RJ655

Category

RoHS

Lead Count

655

Pb (Lead) Free

No

Length

24.5mm

Pb Free Category

e1 SnAgCu

Width

19.5mm

Thickness

2.55mm

Peak Reflow Temp

245°C

Pitch

0.8mm

Pkg. Dimensions

24.5 x 19.5 x 2.55

Documents

Title Typesort icon Format File Size Date
COVER TAPE Carrier / Package Type PDF 26 KB Nov 12, 2015
BJ/BJG/HJ/HJG/RH/RJ 655 CARRIER TAPE Carrier / Package Type PDF 30 KB Nov 15, 2015
Quadrant 2 Loading Orientation in Reel form Carrier / Package Type PDF 147 KB Sep 10, 2015
BJ/BJG/HJ/RH/RJ 655 SHIPPING TRAY Carrier / Package Type PDF 336 KB Jan 27, 2013
RJ655 IPC-1752-2 v1.01 Class 6 (MCD) Materials Composition Declaration PDF 916 KB Apr 24, 2008
RJ655 IPC 1752-1 v1.01 Class 4 (MCD) Materials Composition Declaration PDF 533 KB Jan 10, 2008
BJ/RJ/BJG 655 PACKAGE OUTLINE 24.5X19.5mm BODY 0.80mm PITCH FCBGA Package Outline Drawing PDF 1.02 MB Jun 20, 2013
PCN# : TB0803-01 Change of HIC Card Product Change Notification PDF 967 KB May 8, 2008
PCN# : A0609-01 Addition of SPIL, Taiwan as an Alternate Assembly Facility for AMB Product Change Notification PDF 88 KB Oct 9, 2006
PCN# A-0605-01R1 Amkor Taiwan as Alternate Assembly and KYEC Taiwan as Alternate Test Facility for AMB Products Product Change Notification PDF 90 KB Jul 18, 2006
A-0605-01 AMKOR Taiwan as Alternate Assembly Facility for 655L FCBGA Product Change Notification PDF 21 KB May 11, 2006
IDT User Recommended Reflow Profile (RoHS 245C) Reflow Profile PDF 86 KB Jan 31, 2008