RJ655 (FCBGA 655)

Title Information
Package Description FLIP CHIP BGA 24.5 X 19.5 MM 0.80 MM PIT
Package Status Active
Package Type FCBGA
Class PLASTIC
Package Code RJ655
Category RoHS
Lead Count 655
Pb (Lead) Free No
Length 25mm
Pb Free Category e1 SnAgCu
Width 20mm
Thickness 2.6mm
Peak Reflow Temp 245.00°C
Pitch 0.8mm
Package Non-Reel Carrier TRAY
Pkg. Dimensions 24.5 x 19.5 x 2.55

Documentation

Title Other Languages Type Format File Size Date
Datasheets & Errata
BJ/RJ/BJG 655 PACKAGE OUTLINE 24.5X19.5mm BODY 0.80mm PITCH FCBGA - Package Outline Drawing PDF 1.02 MB Jun 19, 2013
PCNs & PDNs
PCN# : TB0803-01 Change of HIC Card - Product Change Notification PDF 967 KB May 7, 2008
PCN# A-0605-01R1 Amkor Taiwan as Alternate Assembly and KYEC Taiwan as Alternate Test Facility for AMB Products - Product Change Notification PDF 90 KB Jul 17, 2006
PCN# : A0609-01 Addition of SPIL, Taiwan as an Alternate Assembly Facility for AMB - Product Change Notification PDF 88 KB Oct 8, 2006
A-0605-01 AMKOR Taiwan as Alternate Assembly Facility for 655L FCBGA - Product Change Notification PDF 21 KB May 10, 2006
Other
BJ/BJG/HJ/HJG/RH/RJ 655 CARRIER TAPE - Carrier / Package Type PDF 30 KB Nov 14, 2015
COVER TAPE - Carrier / Package Type PDF 26 KB Nov 11, 2015
Quadrant 2 Loading Orientation in Reel form - Carrier / Package Type PDF 147 KB Sep 9, 2015
RJ655 IPC-1752-2 v1.01 Class 6 (MCD) - Materials Composition Declaration PDF 916 KB Apr 23, 2008
RJ655 IPC 1752-1 v1.01 Class 4 (MCD) - Materials Composition Declaration PDF 533 KB Jan 9, 2008
IDT User Recommended Reflow Profile (RoHS 245C) - Reflow Profile PDF 86 KB Jan 30, 2008