Skip to main content
QS34XVH2245 - Block Diagram


QuickSwitch Products 3.3V 32-Bit Bus Switch for Hot Swap Applications

The QS34XVH2245 is a high bandwidth, 32-bit bus switch. The QS34XVH2245 with 25 ohm resistance and 1.35ns propagation delay is ideal for line matching and low noise environments. The switches can be turned ON under the control of individual LVTTL-compatible Output Enable (OEx) signals for bidirectional data flow with no added delay or ground bounce. The combination of small propagation delay, high OFF impedance, and over-voltage tolerance makes the QS34XVH2245 ideal for high performance communications applications. The QS34XVH2245 operates from -40C to +85C.


  • N channel FET switches with no parasitic diode to VCC – Isolation under power-off conditions – No DC path to VCC or GND – 5V tolerant in OFF and ON state
  • 5V tolerant I/Os
  • Flat RON characteristics over operating range
  • Rail-to-rail switching 0 - 5V
  • Bidirectional dataflow with near-zero delay: no added ground bounce
  • Excellent RON matching between channels
  • VCC operation: 2.3V to 3.6V
  • High bandwidth
  • LVTTL-compatible control Inputs
  • Undershoot Clamp Diodes on all switch and control Inputs
  • Low I/O capacitance, 4pF typical
  • 25 ohm resistors for low noise and line matching
  • Available in 80-pin QVSOP package

Product Specification

FunctionPkg. CodeTemp. RangeBus Width (bits)Core Voltage (V)Output TypeOn Resistance (Ω)Speed Grade
245 Switch w/Series ResisterDMG80-40 to 85°C323.328Standard

Product Options

Orderable Part IDPart StatusPkg. CodePkg. TypeLead Count (#)Temp. GradePb (Lead) FreeCarrier TypeSample & Buy
QS34XVH2245Q3GActiveDMG80QVSOP80IYesTubeCheck Availability
QS34XVH2245Q3G8ActiveDMG80QVSOP80IYesReelCheck Availability


Technical Documentation

Title Type Format File Size Datesort icon
Datasheets & Errata
QS34XVH2245 Datasheet Datasheet PDF 264 KB Jan 17, 2013
Errata LEN-08-01 Errata PDF 65 KB Aug 18, 2008
Apps Notes & White Papers
AN-20: Board Assembly for 0.4mm Pin Surface Mounts Application Note PDF 62 KB Jun 1, 1996
PCN# : A1301-01 Gold to Copper Wire Product Change Notice PDF 99 KB Jan 28, 2013
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB Nov 14, 2012
PCN# : A-0605-04 UNISEM-Malaysia as Alternate Assembly Facility for QVSOP Packages Product Change Notice PDF 102 KB May 24, 2006
show all (16)
PCN# A-0508-02: OSET Alternate Assembly Location for Green Product Change Notice PDF 18 KB Sep 2, 2005
PCN# A-0504-02R2: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 38 KB Aug 4, 2005
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 16 KB Jul 22, 2005
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT Product Change Notice PDF 35 KB Apr 29, 2005
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph Product Change Notice PDF 47 KB Apr 29, 2005
PCN#:A-0312-01, new mold compound material - G600 Product Change Notice PDF 109 KB Dec 3, 2003
PCN#:A-0312-02, new die attach material - 8290 Product Change Notice PDF 116 KB Dec 3, 2003
PCN # L0306-02 Fab 2 to Fab 4 Transfer Product Change Notice PDF 96 KB Jul 3, 2003
PCN# L0206-11 ICCQ Max Limit Change Product Change Notice PDF 9 KB Aug 1, 2002
PCN# G0202-01, Alternate assembly facility Product Change Notice PDF 16 KB Feb 8, 2002
PCN# L0108-01R1, Die Revision from YQ, ZQ, QC to Z Product Change Notice PDF 12 KB Dec 10, 2001
PCN# G0106-01, Moisture Sensitive Label Change Product Change Notice PDF 274 KB Jun 11, 2001
PCN# G0005-01, Laser Top Mark Product Change Notice PDF 24 KB May 10, 2000

Software & Tools

Title Type Format File Size Datesort icon
QS34XVH2245 Hspice Model Model - HSPICE ZIP 18 KB May 23, 2002
QS34XVH2245 IBIS model Model - IBIS ZIP 9 KB Dec 8, 2003