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QS34XVH245 - Block Diagram

QS34XVH245

QuickSwitch Products 3.3V 32-Bit Bus Switch for Hot Swap Applications

The QS34XVH245 HotSwitch is a high bandwidth 32-bit bus switch with very low ON resistance, resulting in under 250ps propagation delay through the switch. The switches can be turned ON under the control of individual LVTTL-compatible Output Enable (OEx) signals for bidirectional data flow with no added delay or ground bounce. The combination of near-zero propagation delay, high OFF impedance, and over-voltage tolerance makes the QS34XVH245 ideal for high performance communications applications. The QS34XVH245 operates from -40C to +85C.

Features

  • N channel FET switches with no parasitic diode to VCC – Isolation under power-off conditions – No DC path to VCC or GND – 5V tolerant in OFF and ON state
  • 5V tolerant I/Os
  • Low RON , 4 ohm typical
  • Flat RON characteristics over operating range
  • Rail-to-rail switching 0 - 5V
  • Bidirectional dataflow with near-zero delay: no added ground bounce
  • Excellent RON matching between channels
  • VCC operation: 2.3V to 3.6V
  • High bandwidth - up to 500MHz
  • LVTTL-compatible control Inputs
  • Undershoot Clamp Diodes on all switch and control Inputs
  • Low I/O capacitance, 4pF typical
  • Available in 80-pin QVSOP package

Product Specification

FunctionPkg. CodeTemp. RangeBus Width (bits)Core Voltage (V)Output TypeOn Resistance (Ω)Speed Grade
245 SwitchDMG80-40 to 85°C323.35Standard

Product Options

Orderable Part IDPart StatusPkg. CodePkg. TypeLead Count (#)Temp. GradePb (Lead) FreeCarrier TypeSample & Buy
QS34XVH245Q3GActiveDMG80QVSOP80IYesTubeCheck Availability
QS34XVH245Q3G8ActiveDMG80QVSOP80IYesReelCheck Availability

Documents

Technical Documentation

Title Type Format File Size Datesort icon
Datasheets & Errata
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QS34XVH245 Datasheet Datasheet PDF 263 KB Jan 17, 2013
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Errata LEN-08-01 Errata PDF 65 KB Aug 18, 2008
Apps Notes & White Papers
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AN-20: Board Assembly for 0.4mm Pin Surface Mounts Application Note PDF 62 KB Jun 1, 1996
PCNs & PDNs
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PCN# : A1301-01 Gold to Copper Wire Product Change Notice PDF 99 KB Jan 28, 2013
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PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB Nov 14, 2012
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PCN# : A-0605-04 UNISEM-Malaysia as Alternate Assembly Facility for QVSOP Packages Product Change Notice PDF 102 KB May 24, 2006
show all (16)
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PCN# A-0508-02: OSET Alternate Assembly Location for Green Product Change Notice PDF 18 KB Sep 2, 2005
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PCN# A-0504-02R2: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 38 KB Aug 4, 2005
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PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 16 KB Jul 22, 2005
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PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT Product Change Notice PDF 35 KB Apr 29, 2005
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PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph Product Change Notice PDF 47 KB Apr 29, 2005
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PCN#:A-0312-01, new mold compound material - G600 Product Change Notice PDF 109 KB Dec 3, 2003
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PCN#:A-0312-02, new die attach material - 8290 Product Change Notice PDF 116 KB Dec 3, 2003
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PCN # L0306-02 Fab 2 to Fab 4 Transfer Product Change Notice PDF 96 KB Jul 3, 2003
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PCN# L0206-11 ICCQ Max Limit Change Product Change Notice PDF 9 KB Aug 1, 2002
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PCN# G0202-01, Alternate assembly facility Product Change Notice PDF 16 KB Feb 8, 2002
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PCN# G0106-01, Moisture Sensitive Label Change Product Change Notice PDF 274 KB Jun 11, 2001
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PCN L0105-03: Die Revision Product Change Notice PDF 11 KB May 24, 2001
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PCN# G0005-01, Laser Top Mark Product Change Notice PDF 24 KB May 10, 2000

Software & Tools

Title Type Format File Size Datesort icon
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QS34XVH245 Hspice Model Model - HSPICE ZIP 18 KB Aug 27, 2003
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QS34XVH245 IBIS Model Model - IBIS ZIP 9 KB Dec 8, 2003