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QS32245 - Block Diagram

QS32245

High-Speed CMOS QuikSwitch 8-Bit Bus Switch

The QS32245 provides a set of eight high-speed CMOS TTL-compatible bus switches in a pinout compatible with 74FCT245, 74F245, 74ALS/AS/ LS245 8-bit transceivers. The QS32245 has 25 ohm series resistors to reduce ground bounce noise. The QS32245 operates at -40C to +85C.

Features

  • Enhanced N channel FET with no inherent diode to Vcc
  • 5 ohm bidirectional switches connect inputs to outputs
  • Zero propagation delay, zero ground bounce
  • Undershoot clamp diodes on all switch and control inputs
  • 25 ohm resistors for low noise
  • TTL-compatible control inputs
  • Hot-swapping, hot-docking
  • Voltage translation (5V to 3.3V)
  • Power conservation
  • Capacitance reduction and isolation
  • Clock gating
  • Bus switching and isolation
  • Available in 20 pin QSOP and TSSOP packages

Product Specification

FunctionPkg. CodeTemp. RangeBus Width (bits)Core Voltage (V)Output TypeOn Resistance (Ω)Speed Grade
245 Switch w/Series ResisterPCG20, PGG20-40 to 85°C8528Standard

Product Options

Orderable Part IDPart StatusPkg. CodePkg. TypeLead Count (#)Temp. GradePb (Lead) FreeCarrier TypeSample & Buy
QS32245PAGActivePGG20TSSOP20IYesTubeCheck Availability
QS32245PAG8ActivePGG20TSSOP20IYesReelCheck Availability
QS32245QGActivePCG20QSOP20IYesTubeCheck Availability
QS32245QG8ActivePCG20QSOP20IYesReelCheck Availability

Documents

Technical Documentation

Title Type Format File Size Datesort icon
Datasheets & Errata
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QS32245 Datasheet Datasheet PDF 213 KB Feb 9, 2011
Apps Notes & White Papers
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AN-11: 5V and 3V Conversion with Zero Delay Application Note PDF 346 KB Feb 5, 2014
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Quickswitch Basics Application Note PDF 83 KB Jul 6, 2005
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AN-19: Space Reduction Via Placement Application Note PDF 41 KB Jun 1, 1996
show all (8)
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AN-09: CMOS Bus Switches Provide 0 Delay Application Note PDF 121 KB Jun 1, 1996
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AN-13: Converting TTL to Hot Plug Application Note PDF 85 KB Jun 1, 1996
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AN-17: Peripheral Isolation in Notebook Computers Application Note PDF 68 KB Jun 1, 1996
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AN-20: Board Assembly for 0.4mm Pin Surface Mounts Application Note PDF 62 KB Jun 1, 1996
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TN-07: Analysis of QuickSwitch Behavior Application Note PDF 102 KB Jun 1, 1996
PCNs & PDNs
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PCN# : A1602-01(R1) Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB Apr 14, 2016
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PCN# : A1602-01 Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB Feb 15, 2016
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PCN# : A1511-01(R1) Add SPEL India as Alternate Assembly Location Product Change Notice PDF 596 KB Jan 28, 2016
show all (25)
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PCN# : A1511-01 Add SPEL India as Alternate Assembly Location Product Change Notice PDF 544 KB Nov 13, 2015
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PCN# : TB1503-01R1 Carrier Tape Standardization for Selective Packages Product Change Notice PDF 333 KB Oct 22, 2015
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PCN# : TB1503-01 Carrier Tape Standardization for Selective Packages Product Change Notice PDF 291 KB Jul 21, 2015
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PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB Nov 14, 2012
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PCN# A-0508-02: OSET Alternate Assembly Location for Green Product Change Notice PDF 18 KB Sep 2, 2005
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PCN# A-0504-02R2: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 38 KB Aug 4, 2005
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PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 16 KB Jul 22, 2005
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PDN# L_05_01: Obsolecence Notice Product Delete Notice PDF 133 KB Jul 21, 2005
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PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph Product Change Notice PDF 47 KB Apr 29, 2005
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PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT Product Change Notice PDF 35 KB Apr 29, 2005
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PCN#: A-0501-01, New m/c DMC-2000 and d/a 8390A for PDIP pkgs Product Change Notice PDF 42 KB Jan 25, 2005
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PCN#:A-0401-01, new m/c G600 & 8290 d/a material Product Change Notice PDF 196 KB Jan 19, 2004
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PCN#:A-0312-02, new die attach material - 8290 Product Change Notice PDF 116 KB Dec 3, 2003
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PCN#:A-0312-01, new mold compound material - G600 Product Change Notice PDF 109 KB Dec 3, 2003
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PCN# L0212-01 Fab Site Change to Fab 4 Product Change Notice PDF 50 KB Dec 16, 2002
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PCN# G-0203-05 Mold Compound Product Change Notice PDF 40 KB Apr 16, 2002
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PCN #L0201-03R1 RON Specification Changes Product Change Notice PDF 87 KB Mar 14, 2002
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PCN# G0202-01, Alternate assembly facility Product Change Notice PDF 16 KB Feb 8, 2002
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PCN# G0106-01, Moisture Sensitive Label Change Product Change Notice PDF 274 KB Jun 11, 2001
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PDN# Logic-00-09: Obsolete PDIP Package Product Discontinuation Notice PDF 73 KB Apr 24, 2001
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PCN# G0005-01, Laser Top Mark Product Change Notice PDF 24 KB May 10, 2000
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PCN# G9911-05, To qualify low alpha mold compound. Product Change Notice PDF 44 KB Nov 18, 1999

Software & Tools

Title Type Format File Size Datesort icon
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QS32245 Hspice Model Model - HSPICE ZIP 5 KB Jan 23, 2003
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QS32245 IBIS Model Model - IBIS ZIP 4 KB Jan 23, 2003