512K x 9 SuperSync FIFO, 3.3V

The 72V2111 is a 16K x 9 SuperSync FIFO memory with clocked read and write controls. The Frequency Select pin (FS) has been removed, thus it is no longer necessary to select which of the two clock inputs, RCLK or WCLK, is running at the higher frequency. The period required by the retransmit operation and the first word data latency period is now fixed and short. (The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated on this SuperSync family.)

Features

  • Pin-compatible with the 72V261/271/281/291/2101 SuperSync FIFOs
  • 10ns read/write cycle time (6.5ns access time)
  • Fixed, low first word data latency time
  • 5V input tolerant
  • Auto power down minimizes standby power consumption
  • Retransmit operation with fixed, low first word data latency time
  • Empty, Full and Half-Full flags signal FIFO status
  • Programmable Almost-Empty and Almost-Full flags
  • Easily expandable in depth and width
  • Independent Read and Write clocks (permit reading and writing simultaneously)
  • Available in the 64-pin TQFP package
  • Industrial temperature range (–40C to +85C) is available

Product Options

Orderable Part ID Part Status Pkg. Code Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
72V2111L10PF Active PN64 TQFP 64 C No Tray Availability
72V2111L10PF8 Active PN64 TQFP 64 C No Reel Availability
72V2111L10PFG Active PNG64 TQFP 64 C Yes Tray Availability
72V2111L10PFG8 Active PNG64 TQFP 64 C Yes Reel Availability
72V2111L15PF Active PN64 TQFP 64 C No Tray Availability
72V2111L15PF8 Active PN64 TQFP 64 C No Reel Availability
72V2111L15PFGI Active PNG64 TQFP 64 I Yes Tray Availability
72V2111L15PFGI8 Active PNG64 TQFP 64 I Yes Reel Availability
72V2111L15PFI Active PN64 TQFP 64 I No Tray Availability
72V2111L15PFI8 Active PN64 TQFP 64 I No Reel Availability
72V2111L20PF Active PN64 TQFP 64 C No Tray Availability
72V2111L20PF8 Active PN64 TQFP 64 C No Reel Availability

Technical Documentation

Title Other Languages Type Format File Size Date
Datasheets & Errata
72V2101-72V2111 Datasheet - Datasheet PDF 434 KB Jul 14, 2014
PCNs & PDNs
PCN# : A1606-02 Add Greatek Taiwan as Alternate Assembly - Product Change Notice PDF 567 KB Aug 25, 2016
PCN# G-0110-06 Mold Compound - Product Change Notice PDF 47 KB Dec 13, 2001
PCN# : A-0610-02 ASAT China as Alternate Facility for CABGA/CVBGA/FPBGA/TQFP/PQFP - Product Change Notice PDF 252 KB Oct 18, 2006
PCN#: A-0412-04 - To comply with Pb-free labels - Green Products - Product Change Notice PDF 80 KB Dec 13, 2004
A-0603-04 Transfer TQFP and PQFP from ASAT HK to ASAT China - Product Change Notice PDF 164 KB May 9, 2006
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w - Product Change Notice PDF 24 KB Nov 13, 2012
PCN# G0106-01, Moisture Sensitive Label Change - Product Change Notice PDF 274 KB Jun 10, 2001
PCN#: A-0310-01, Green Products - Product Change Notice PDF 26 KB Oct 9, 2003
PCN#: G-0302-06, New die attach 3230 from Ablestik - Product Change Notice PDF 150 KB Mar 19, 2003
PCN#G-0302-05, New mold compound EME-G700 series - Product Change Notice PDF 65 KB Mar 19, 2003
PCN# G9911-05, To qualify low alpha mold compound. - Product Change Notice PDF 44 KB Nov 17, 1999
PCN A-0506-03; Packing Material Change - Product Change Notice PDF 290 KB Jul 18, 2005
PCN# G-0110-06 REV.1 Mold Compound - Product Change Notice PDF 48 KB Apr 25, 2002
Minor mask change to improve manufac. efficiency. - Product Change Notice PDF 11 KB Feb 4, 2001
PCN# G-0206-08, Orientation of square PQFP & TQFP - Product Change Notice PDF 150 KB Jun 16, 2002
PCN# F0301-02: Die Shrink and Process Change - Product Change Notice PDF 26 KB Mar 30, 2003

Software & Tools

Title Other Languages Type Format File Size Date
72V2111 HSPICE - Model - HSPICE TAR 49 KB Jun 27, 1999
72V2111 IBIS - Model - IBIS ZIP 9 KB Jun 12, 2000