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72V273 - Block Diagram


16K x 18 / 32K x 9 SuperSync II FIFO, 3.3V

The 72V273 32K x 9/16K x 18 SuperSync II FIFO memory has flexible x9/x18 Bus-Matching on both read and write ports. The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated. SuperSync II FIFOs are appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match buses of unequal sizes.


  • Functionally compatible with the 72V255/65/75/85 SuperSync FIFOs
  • Up to 166 MHz Operation of the Clocks
  • User selectable Asynchronous read and/or write ports (BGA Only)
  • User selectable input and output port bus sizing
  • Pin to Pin compatible to the higher density 72V2x3/72V21x3 devices
  • 5V tolerant inputs
  • Auto power down minimizes standby power consumption
  • Master Reset clears entire FIFO
  • Partial Reset clears data, but retains programmable settings
  • Easily expandable in depth and width
  • JTAG port, provided for Boundary Scan function (BGA Only)
  • Independent Read and Write Clocks
  • Available in 80-pin TQFP or 100-pin BGA packages
  • Industrial temperature range (–40C to +85C) is available

Product Specification

Core Voltage (V)Bus Width (bits)Density (Kb)Pkg. CodeInterfaceI/O TypeI/O Frequency (MHz)Cycle Time (ns)OrganizationTemp. RangeArchitectureAccess Time (ns)
3.318288BC100, BCG100, PN80, PNG80Synchronous3.3 V LVTTL66.00, 100.00, 133.00, 166.0016K x 18, 32K x 9-40 to 85°C, 0 to 70°CUni-directional

Product Options

Orderable Part IDPart StatusPkg. CodePkg. TypeLead Count (#)Temp. GradePb (Lead) FreeCarrier TypeSample & Buy
72V273L10PFActivePN80TQFP80CNoTrayCheck Availability
72V273L10PF8ActivePN80TQFP80CNoReelCheck Availability
72V273L10PFGActivePNG80TQFP80CYesTrayCheck Availability
72V273L10PFG8ActivePNG80TQFP80CYesReelCheck Availability
72V273L10PFIActivePN80TQFP80INoTrayCheck Availability
72V273L10PFI8ActivePN80TQFP80INoReelCheck Availability
72V273L15PFActivePN80TQFP80CNoTrayCheck Availability
72V273L15PF8ActivePN80TQFP80CNoReelCheck Availability
72V273L6BCActiveBC100CABGA100CNoTrayCheck Availability
72V273L6PFActivePN80TQFP80CNoTrayCheck Availability
72V273L6PF8ActivePN80TQFP80CNoReelCheck Availability
72V273L6PFGActivePNG80TQFP80CYesTrayCheck Availability
72V273L7-5BCActiveBC100CABGA100CNoTrayCheck Availability
72V273L7-5BCGIActiveBCG100CABGA100IYesTrayCheck Availability
72V273L7-5BCGI8ActiveBCG100CABGA100IYesReelCheck Availability
72V273L7-5BCIActiveBC100CABGA100INoTrayCheck Availability
72V273L7-5PFActivePN80TQFP80CNoTrayCheck Availability
72V273L7-5PF8ActivePN80TQFP80CNoReelCheck Availability
72V273L7-5PFGIActivePNG80TQFP80IYesTrayCheck Availability
72V273L7-5PFGI8ActivePNG80TQFP80IYesReelCheck Availability
72V273L7-5PFIActivePN80TQFP80INoTrayCheck Availability


Technical Documentation

Title Type Format File Size Datesort icon
Datasheets & Errata
72V223-72V293 Datasheet Datasheet PDF 547 KB Jul 15, 2014
Apps Notes & White Papers
AN-265: Bus Matching with IDT FIFOs Application Note PDF 165 KB May 12, 2006
PCN# : A1606-02 Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 567 KB Aug 26, 2016
PCN# : A1212-01 Change of Mold Compound Product Change Notice PDF 100 KB Dec 21, 2012
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB Nov 14, 2012
show all (19)
PCN# : A-0610-02 ASAT China as Alternate Facility for CABGA/CVBGA/FPBGA/TQFP/PQFP Product Change Notice PDF 252 KB Oct 19, 2006
A-0603-04 Transfer TQFP and PQFP from ASAT HK to ASAT China Product Change Notice PDF 164 KB May 10, 2006
PCN A-0506-03; Packing Material Change Product Change Notice PDF 290 KB Jul 19, 2005
PCN#: A-0412-04 - To comply with Pb-free labels - Green Products Product Change Notice PDF 80 KB Dec 14, 2004
PCN#: A-0403-03, BGA package family Product Change Notice PDF 38 KB Dec 9, 2004
PCN#: A-0310-01, Green Products Product Change Notice PDF 26 KB Oct 10, 2003
PCN#:A-0305-02, new m/c G770 & 2300 d/a material Product Change Notice PDF 197 KB Jun 4, 2003
PCN#: G-0302-06, New die attach 3230 from Ablestik Product Change Notice PDF 150 KB Mar 20, 2003
PCN#G-0302-05, New mold compound EME-G700 series Product Change Notice PDF 65 KB Mar 20, 2003
PCN# G-0206-08, Orientation of square PQFP & TQFP Product Change Notice PDF 150 KB Jun 17, 2002
PCN# G-0110-06 REV.1 Mold Compound Product Change Notice PDF 48 KB Apr 26, 2002
PCN# G-0110-06 Mold Compound Product Change Notice PDF 47 KB Dec 14, 2001
F0111-01: Die Shrink and Process Change Product Change Notice PDF 22 KB Nov 7, 2001
PCN# G0106-01, Moisture Sensitive Label Change Product Change Notice PDF 274 KB Jun 11, 2001
Minor mask change to improve manufac. efficiency. Product Change Notice PDF 11 KB Feb 5, 2001
PCN# G9911-05, To qualify low alpha mold compound. Product Change Notice PDF 44 KB Nov 18, 1999

Software & Tools

Title Type Format File Size Datesort icon
72V273BC BSDL Model - BSDL ZIP 2 KB Dec 12, 2005
72V273 HSPICE Model - HSPICE application/x-tar 49 KB Jun 29, 1999