64K x 18 / 128K x 9 SuperSync II FIFO, 3.3V

The 72V293 128K x 9/64K x 18 SuperSync II FIFO memory has flexible x9/x18 Bus-Matching on both read and write ports. The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated. SuperSync II FIFOs are appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match buses of unequal sizes.

Features

  • Functionally compatible with the 72V255/65/75/85 SuperSync FIFOs
  • Up to 166 MHz Operation of the Clocks
  • User selectable Asynchronous read and/or write ports (BGA Only)
  • User selectable input and output port bus sizing
  • Pin to Pin compatible to the higher density 72V2x3/72V21x3 devices
  • 5V tolerant inputs
  • Auto power down minimizes standby power consumption
  • Master Reset clears entire FIFO
  • Partial Reset clears data, but retains programmable settings
  • Easily expandable in depth and width
  • JTAG port, provided for Boundary Scan function (BGA Only)
  • Independent Read and Write Clocks
  • Available in 80-pin TQFP or 100-pin BGA packages
  • Industrial temperature range (–40C to +85C) is available

Product Options

Orderable Part ID Part Status Pkg. Code Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
72V293L10PF Active PN80 TQFP 80 C No Tray Availability
72V293L10PF8 Active PN80 TQFP 80 C No Reel Availability
72V293L10PFI Active PN80 TQFP 80 I No Tray Availability
72V293L10PFI8 Active PN80 TQFP 80 I No Reel Availability
72V293L15PF Active PN80 TQFP 80 C No Tray Availability
72V293L15PF8 Active PN80 TQFP 80 C No Reel Availability
72V293L6BC Active BC100 CABGA 100 C No Tray Availability
72V293L6PF Active PN80 TQFP 80 C No Tray Availability
72V293L6PF8 Active PN80 TQFP 80 C No Reel Availability
72V293L6PFG Active PNG80 TQFP 80 C Yes Tray Availability
72V293L7-5BC Active BC100 CABGA 100 C No Tray Availability
72V293L7-5BCI Active BC100 CABGA 100 I No Tray Availability
72V293L7-5PF Active PN80 TQFP 80 C No Tray Availability
72V293L7-5PF8 Active PN80 TQFP 80 C No Reel Availability
72V293L7-5PFGI Active PNG80 TQFP 80 I Yes Tray Availability
72V293L7-5PFI Active PN80 TQFP 80 I No Tray Availability

Technical Documentation

Title Other Languages Type Format File Size Date
Datasheets & Errata
72V223-72V293 Datasheet - Datasheet PDF 547 KB Jul 14, 2014
Apps Notes & White Papers
AN-265: Bus Matching with IDT FIFOs - Application Note PDF 165 KB May 11, 2006
PCNs & PDNs
PCN# : A1606-02 Add Greatek Taiwan as Alternate Assembly - Product Change Notice PDF 567 KB Aug 25, 2016
PCN# : A1212-01 Change of Mold Compound - Product Change Notice PDF 100 KB Dec 20, 2012
PCN# G-0110-06 Mold Compound - Product Change Notice PDF 47 KB Dec 13, 2001
PCN# : A-0610-02 ASAT China as Alternate Facility for CABGA/CVBGA/FPBGA/TQFP/PQFP - Product Change Notice PDF 252 KB Oct 18, 2006
PCN#: A-0412-04 - To comply with Pb-free labels - Green Products - Product Change Notice PDF 80 KB Dec 13, 2004
A-0603-04 Transfer TQFP and PQFP from ASAT HK to ASAT China - Product Change Notice PDF 164 KB May 9, 2006
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w - Product Change Notice PDF 24 KB Nov 13, 2012
PCN# G0106-01, Moisture Sensitive Label Change - Product Change Notice PDF 274 KB Jun 10, 2001
PCN#: A-0310-01, Green Products - Product Change Notice PDF 26 KB Oct 9, 2003
PCN#: A-0403-03, BGA package family - Product Change Notice PDF 38 KB Dec 8, 2004
PCN#: G-0302-06, New die attach 3230 from Ablestik - Product Change Notice PDF 150 KB Mar 19, 2003
PCN#G-0302-05, New mold compound EME-G700 series - Product Change Notice PDF 65 KB Mar 19, 2003
PCN# G9911-05, To qualify low alpha mold compound. - Product Change Notice PDF 44 KB Nov 17, 1999
PCN A-0506-03; Packing Material Change - Product Change Notice PDF 290 KB Jul 18, 2005
PCN#:A-0305-02, new m/c G770 & 2300 d/a material - Product Change Notice PDF 197 KB Jun 3, 2003
PCN#: TB-0512-01 Reel Color Changed from Blue to Black - Product Change Notice PDF 729 KB Dec 15, 2005
PCN# G-0110-06 REV.1 Mold Compound - Product Change Notice PDF 48 KB Apr 25, 2002
F0111-01: Die Shrink and Process Change - Product Change Notice PDF 22 KB Nov 6, 2001
Minor mask change to improve manufac. efficiency. - Product Change Notice PDF 11 KB Feb 4, 2001
PCN# G-0206-08, Orientation of square PQFP & TQFP - Product Change Notice PDF 150 KB Jun 16, 2002

Software & Tools

Title Other Languages Type Format File Size Date
72V293 HSPICE - Model - HSPICE TAR 48 KB Jun 28, 1999
72V293BC BSDL - Model - BSDL ZIP 2 KB Dec 11, 2005