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5962-85525

5.0V 8K x 8 Asynchronous Static RAM

The 5962-85525 (7164 SRAM) is organized as 8K x 8 and offers a reduced power standby mode. This version also offers a battery backup data retention capability at power supply levels as low as 2V. All inputs and outputs are TTL-compatible and operation is from a single 5V supply, simplifying system designs. Fully static asynchronous circuitry is used, requiring no clocks or refreshing for operation.

Features

  • High-speed address/chip select access time – 85ns (max.)
  • Low power consumption
  • Battery backup operation – 2V data retention voltage
  • Produced with advanced CMOS high-performance technology
  • Inputs and outputs directly TTL-compatible
  • Three-state outputs
  • Available in 28-pin 600 mil ceramic DIP package
  • Military product compliant to MIL-STD-883, Class B

Product Specification

Density (Kb)Bus Width (bits)Core Voltage (V)Pkg. CodeOrganizationI/O Voltage (V)Access Time (ns)I/O Frequency (MHz)Temp. RangeArchitectureOutput Type
6485CD288K x 85.0085-55 to 125°CAsynchronous

Product Options

Orderable Part IDPart StatusPkg. CodePkg. TypeLead Count (#)Temp. GradePb (Lead) FreeCarrier TypeSample & Buy
5962-8552512XAActiveCD28CDIP28MNoTubeCheck Availability

Documents

Technical Documentation

Title Type Format File Size Datesort icon
Datasheets & Errata
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7164SL Data Sheet Datasheet PDF 80 KB Nov 5, 2014
PCNs & PDNs
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PCN# : A1504-01 Change Silver Glass adhesive material Product Change Notice PDF 27 KB Apr 27, 2015
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PCN# : A1503-01 New Die Coat Materials Product Change Notice PDF 24 KB Apr 12, 2015
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PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB Nov 14, 2012
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PCN# : A-0605-05 AIT as Alternate Assembly Facility for SOIC/QSOP/SSOP/TSSOP/PDIP Product Change Notice PDF 298 KB May 25, 2006
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PCN# : A-0605-03 ASE-Kaohsiung as Alternate Assembly Facility for SOJ Packages Product Change Notice PDF 115 KB May 24, 2006
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PCN# A-0508-02: OSET Alternate Assembly Location for Green Product Change Notice PDF 18 KB Sep 2, 2005
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PCN# A-0504-02R2: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 38 KB Aug 4, 2005
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PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 16 KB Jul 22, 2005
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PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT Product Change Notice PDF 35 KB Apr 29, 2005
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PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph Product Change Notice PDF 47 KB Apr 29, 2005
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PCN#: A-0501-01, New m/c DMC-2000 and d/a 8390A for PDIP pkgs Product Change Notice PDF 42 KB Jan 25, 2005
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PCN#: A-0412-04 - To comply with Pb-free labels - Green Products Product Change Notice PDF 80 KB Dec 14, 2004
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PCN#:A-0309-06 Rev1, Hermetic transfer to ATP-P1 Product Change Notice PDF 44 KB Oct 15, 2004
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PCN#: A-0305-04 Rev. 01, Tin Plating and Solder Dip Process at G Product Change Notice PDF 38 KB Mar 4, 2004
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PCN#: A-0310-01, Green Products Product Change Notice PDF 26 KB Oct 10, 2003
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PCN SR-0203-02 Wafer Fab Transfer, Fab 2 to Fab 4 Product Change Notice PDF 41 KB Mar 15, 2002
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PCN# G9911-05, To qualify low alpha mold compound. Product Change Notice PDF 44 KB Nov 18, 1999