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5962-88740

5.0V 2K x 8 Asynchronous Static RAM

The 5962-88740 (6116 SRAM) is organized as 2K x 8. This part offers a reduced power standby mode.This low-power version also offers a battery backup data retention capability where the circuit typically consumes only 1µW to 4µW operating off a 2V battery. All inputs and outputs are TTL-compatible. Fully static asynchronous circuitry is used, requiring no clocks or refreshing for operation.

Features

  • High-speed access and chip select times – 25/35ns (max.)
  • Low-power consumption
  • Battery backup operation – 2V data retention voltage
  • Produced with advanced CMOS high-performance technology
  • CMOS process virtually eliminates alpha particle soft-error rates
  • Input and output directly TTL-compatible
  • Static operation: no clocks or refresh required
  • Available in 24-pin (300 mil) ceramic DIP package
  • Military product compliant to MIL-STD-833, Class B

Product Specification

Density (Kb)Bus Width (bits)Core Voltage (V)Pkg. CodeOrganizationI/O Voltage (V)Access Time (ns)I/O Frequency (MHz)Temp. RangeArchitectureOutput Type
1685SD242K x 85.0025, 35-55 to 125°CAsynchronous

Product Options

Orderable Part IDPart StatusPkg. CodePkg. TypeLead Count (#)Temp. GradePb (Lead) FreeCarrier TypeSample & Buy
5962-8874001LAActiveSD24CDIP24MNoTubeCheck Availability
5962-8874002LAActiveSD24CDIP24MNoTubeCheck Availability

Documents

Technical Documentation

Title Type Format File Size Datesort icon
Datasheets & Errata
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6116SA_LA Data Sheet Datasheet PDF 82 KB Nov 5, 2014
PCNs & PDNs
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PCN# : A1504-01 Change Silver Glass adhesive material Product Change Notice PDF 27 KB Apr 27, 2015
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PCN# : A1503-01 New Die Coat Materials Product Change Notice PDF 24 KB Apr 12, 2015
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PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB Nov 14, 2012
show all (18)
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PCN# : TB0911-02 LASER TOP MARK ON CERDIP 300 MILS, CERDIP 600 MILS, Product Change Notice PDF 85 KB Nov 12, 2009
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PCN# : A-0605-05 AIT as Alternate Assembly Facility for SOIC/QSOP/SSOP/TSSOP/PDIP Product Change Notice PDF 298 KB May 25, 2006
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PCN# A-0508-02: OSET Alternate Assembly Location for Green Product Change Notice PDF 18 KB Sep 2, 2005
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PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT Product Change Notice PDF 35 KB Apr 29, 2005
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PCN#: A-0501-01, New m/c DMC-2000 and d/a 8390A for PDIP pkgs Product Change Notice PDF 42 KB Jan 25, 2005
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PCN#: A-0412-04 - To comply with Pb-free labels - Green Products Product Change Notice PDF 80 KB Dec 14, 2004
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PCN#:A-0309-06 Rev1, Hermetic transfer to ATP-P1 Product Change Notice PDF 44 KB Oct 15, 2004
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PCN#: A-0305-04 Rev. 01, Tin Plating and Solder Dip Process at G Product Change Notice PDF 38 KB Mar 4, 2004
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PCN#:A-0401-01, new m/c G600 & 8290 d/a material Product Change Notice PDF 196 KB Jan 19, 2004
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PCN#: A-0310-01, Green Products Product Change Notice PDF 26 KB Oct 10, 2003
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PCN# G-0203-05 Mold Compound Product Change Notice PDF 40 KB Apr 16, 2002
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PCN SR-0203-02 Wafer Fab Transfer, Fab 2 to Fab 4 Product Change Notice PDF 41 KB Mar 15, 2002
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PCN# G0106-01, Moisture Sensitive Label Change Product Change Notice PDF 274 KB Jun 11, 2001
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PCN# G0005-01, Laser Top Mark Product Change Notice PDF 24 KB May 10, 2000
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PCN# G9911-05, To qualify low alpha mold compound. Product Change Notice PDF 44 KB Nov 18, 1999