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ZSSC3026 - Application Circuit
ZSSC3026 - Block Diagram
ZSSC3026 Pad Assignments

ZSSC3026

Low Power, High Resolution 16-Bit Sensor Signal Conditioner

The ZSSC3026 is a sensor signal conditioner (SSC) integrated circuit for high-accuracy amplification and analog-to-digital conversion of a differential input signal. Designed for high-resolution altimeter module applications, the ZSSC3026 can perform offset, span, and 1st and 2nd order temperature compensation of the measured signal. Developed for correction of resistive bridge sensors, it can also provide a corrected temperature output measured with an internal sensor. The measured and corrected bridge values are provided at the digital output pins, which can be configured as I2C (≤ 3.4MHz) or SPI (≤ 20MHz). Digital compensation of signal offset, sensitivity, temperature, and non-linearity is accomplished via an 18-bit internal digital signal processor (DSP) running a correction algorithm. Calibration coefficients are stored on-chip in a highly reliable, non-volatile, multiple-time programmable (MTP) memory. Programming the ZSSC3026 is simple via the serial interface. The IC-internal charge pump provides the MTP programming voltage. The interface is used for the PC-controlled calibration procedure, which programs the set of calibration coefficients in memory. Digital mating of the sensor with the signal conditioner is fast and precise, eliminating the overhead normally associated with trimming external components and multi-pass calibration routines.

Features

  • Flexible, programmable analog front-end design, up to 16-bit scalable, charge-balancing two-segment analog-to-digital converter (ADC)
  • Fully programmable gain amplifier accepting sensors from 14 to 72 (linear factor)
  • Internal auto-compensated temperature sensor
  • Digital compensation of individual sensor offset
  • 1st and 2nd order digital compensation of sensor gain
  • Digital compensation of 1st and 2nd order temperature gain and offset drift
  • Intelligent power management unit
  • Layout customized for die-die bonding with sensor for high-density chip-on-board assembly
  • Typical sensor elements can achieve accuracy of less than ±0.10% FSO @ -40 to 110 °C

Product Specification

FunctionTemp. RangeSupply Voltage (V)Input TypeInterfaceResolution (bits)
Resistive SSC-40 to 85°C, 0 to 70°C1.80 - 3.60Single-bridgeSPI, I2C16

Product Options

Orderable Part IDPart StatusPkg. CodePkg. TypeLead Count (#)Temp. RangeCarrier TypeSample & Buy
ZSSC3026CC1BActiveDICEWAFER00 to 70°CReelCheck Availability
ZSSC3026CI1BActiveDICEWAFER0-40 to 85°CReelCheck Availability

Documents

Technical Documentation

Title Type Format File Size Datesort icon
Datasheets & Errata
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ZSSC3026 Datasheet Datasheet PDF 704 KB Apr 6, 2016
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ZSSC3026 Short-form Datasheet Short Form Datasheet PDF 95 KB Apr 6, 2016
User Guides & Manuals
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ZSSC30x6 Evaluation Kit Description Manual PDF 2.10 MB Apr 17, 2016
Apps Notes & White Papers
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IDT Wafer Dicing Guidelines Application Note PDF 44 KB Apr 17, 2016
Other
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IDT CAD Altium Libraries for AID Products Rev 20160819 PCB Design Files ZIP 1.20 MB Aug 19, 2016

Software & Tools

Title Type Format File Size Datesort icon
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ZSSC3026 and ZSSC3036 Evaluation Kit Software Rev. 3.1_3026_3036 Software ZIP 8.10 MB Apr 6, 2016

Related Videos

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Evaluation Boards