Green Flip Chip Products
- Solder bumps are SnAg. Solder balls are SnAgCu.
- In addition to being RoHS compliant, IDT Flip Chip products have the following package material limits:
- Bromine (Br) < 900 ppm
- Chlorine (Cl) < 900 ppm
- Antimony( Sb) < 750 ppm (same as Antimony Trioxide(Sb2O3) < 900 ppm)
- Red Phosphorous(P4) < 100 ppm