Skip to main content

IDT Green Product Packaging

Green Leadframe products

  • Terminals are plated with 100% matte Tin over Copper, which is annealed at 150°C for 1 hour within 24 hours after plating.
  • In addition to being RoHS compliant, IDT Green products have the following package material limits:
    • Bromine (Br) < 900 ppm
    • Chlorine (Cl) < 900 ppm
    • Antimony (Sb) < 750 ppm (same as Antimony Trioxide (Sb2O3) < 900 ppm)
    • Red Phosphorous (P4) < 100 ppm

Green BGA products

  • Solder balls are SnAgCu
  • In additional to being RoHS compliant, IDT Green products have the following package material limits:
    • Bromine (Br) < 900 ppm
    • Chlorine (Cl) < 900 ppm
    • Antimony( Sb) < 750 ppm (same as Antimony Trioxide(Sb2O3) < 900 ppm)

Green Flip Chip products

  • Solder bumps are SnAg. Solder balls are SnAgCu.
  • In addition to being RoHS compliant, IDT Flip Chip products have the following package material limits:
    • Bromine (Br) < 900 ppm
    • Chlorine (Cl) < 900 ppm
    • Antimony( Sb) < 750 ppm (same as Antimony Trioxide(Sb2O3) < 900 ppm)
    • Red Phosphorous(P4) < 100 ppm