The QS34X245 provides a set of 32 high-speed CMOS compatible bus switches in a flow-through pinout. The low ON-resistance of the QS34X245 allows inputs to be connected to outputs without adding propagation delay and without generating additional ground bounce noise. This device is ideally suited for 32/64 bit applications where board space is at a premium. The QS34X245 operates at -40C to +85C.

特長

  • Enhanced N channel FET with no inherent diode to Vcc
  • Bidirectional switches connect inputs to outputs
  • Zero propagation delay, zero ground bounce
  • QS34X245 is 32-bit version of QS3245
  • Flow-through pinout for easy layout
  • Undershoot clamp diodes on all switch and control inputs
  • TTL-compatible control inputs
  • Available in 80-pin MilliPaQ™ package

製品選択

発注型名 Part Status Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type パッケージ 購入/サンプル
QS34X245Q3G Active QVSOP 80 C はい Tube Package Info
Availability
QS34X245Q3G8 Active QVSOP 80 C はい Reel Package Info
Availability

ドキュメント&ダウンロード

タイトル 他の言語 分類 形式 サイズ 日付
データシート
QS34X245 Datasheet Datasheet PDF 273 KB
アプリケーションノート、ホワイトペーパー
AN-11: 5V and 3V Conversion with Zero Delay Application Note PDF 417 KB
Quickswitch Basics Application Note PDF 142 KB
AN-19: Space Reduction Via Placement Application Note PDF 41 KB
AN-09: CMOS Bus Switches Provide 0 Delay Application Note PDF 121 KB
AN-20: Board Assembly for 0.4mm Pin Surface Mounts Application Note PDF 62 KB
AN-17: Peripheral Isolation in Notebook Computers Application Note PDF 68 KB
AN-13: Converting TTL to Hot Plug Application Note PDF 85 KB
TN-07: Analysis of QuickSwitch Behavior Application Note PDF 102 KB
PCN / PDN
PCN# : A1908-02 Adding SPEL India and Greatek Taiwan as Qualified Assembly Facilities Product Change Notice PDF 157 KB
PCN# : A1301-01 Gold to Copper Wire Product Change Notice PDF 99 KB
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB
PCN# : A-0605-04 UNISEM-Malaysia as Alternate Assembly Facility for QVSOP Packages Product Change Notice PDF 102 KB
PCN# A-0508-02: OSET Alternate Assembly Location for Green Product Change Notice PDF 18 KB
PCN# A-0504-02R2: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 38 KB
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 16 KB
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph Product Change Notice PDF 47 KB
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT Product Change Notice PDF 35 KB
PCN#:A-0312-01, new mold compound material - G600 Product Change Notice PDF 109 KB
PCN#:A-0312-02, new die attach material - 8290 Product Change Notice PDF 116 KB
PCN Addendum # L0203-10R1 Fab 2 to Fab 4 Transfer Product Change Notice PDF 110 KB
PCN# L0203-10 Fab Transfer from Fab 2 to Fab 4 Product Change Notice PDF 27 KB
PCN# G0202-01, Alternate assembly facility Product Change Notice PDF 16 KB
PCN# G0106-01, Moisture Sensitive Label Change Product Change Notice PDF 274 KB
PCN# G0005-01, Laser Top Mark Product Change Notice PDF 24 KB
Downloads
QS34X245 IBIS Model Model - IBIS ZIP 5 KB
QS34x245 Hspice Model Model - HSPICE ZIP 6 KB