Chip surface area and the thermal conductivity of the materials in the heat flow path have inverse relationship. Thermal conductivities of commonly used in package materials are listed in the table below. Refer to application note AN-842 for more details on thermal management and package material properties. For other questions not addressed by the Knowledge Base, plase submit a technical support request.

 

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应用指南 &白皮书
AN-842 Thermal Considerations in Package Design and Selection 应用文档 PDF 495 KB