The 7200 is a 256 x 9 dual-port FIFO memory that loads and empties data on a first-in/first-out basis. The device uses Full and Empty flags to prevent data overflow and underflow. It has a Retransmit (RT) capability that allows for reset of the read pointer to its initial position when RT is pulsed LOW. It is designed for those applications requiring asynchronous and simultaneous read/writes in multiprocessing and rate buffer applications.

特性

  • Pin and functionally compatible with 720X family
  • Low power consumption
  • Ultra high speed—12ns access time
  • Asynchronous and simultaneous read and write
  • Fully expandable by both word depth and/or bit width
  • Status Flags: Empty, Half-Full, Full
  • Auto-retransmit capability
  • MIL-STD-883, Class B available in 28 pin (300 mil) Cerdip package
  • Industrial temperature range (–40C to +85C) is available
  • Available in 28 pin SOIC, PDIP (300 mil), and 32 pin PLCC packages

产品选择

下单器件 ID Part Status Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
Active PLCC 32 C 是的 Tube
Availability
Active PLCC 32 C 是的 Reel
Availability
Active SOIC 28 C 是的 Tube
Availability
Active SOIC 28 C 是的 Reel
Availability
Active SOIC 28 I 是的 Tube
Availability
Active SOIC 28 I 是的 Reel
Availability
Active CDIP 28 M Tube
Availability
Active CDIP 28 M Tube
Availability

文档和下载

文档标题 其他语言 类型 文档格式 文件大小 日期
数据手册与勘误表
7200/7201/7202 Datasheet 数据手册 PDF 176 KB
使用指南与说明
Cypress Discontinued Dual-port and FIFO to IDT Cross Reference Guide 指南 PDF 123 KB
应用指南 &白皮书
TN-09: Cascading FIFOs or FIFO Modules 应用文档 PDF 113 KB
PCN / PDN
PCN# : A1908-02 Adding SPEL India and Greatek Taiwan as Qualified Assembly Facilities 产品变更通告 PDF 157 KB
PDN# : SP-17-02 PRODUCT DISCONTINUANCE NOTICE FOR SPO DEVICES 产品停产通告 PDF 645 KB
PCN# : A1602-01(R1) Add Greatek Taiwan as Alternate Assembly 产品变更通告 PDF 611 KB
PCN# : A1602-01 Add Greatek Taiwan as Alternate Assembly 产品变更通告 PDF 611 KB
PDN# : FS-15-02R1 PRODUCT DISCONTINUANCE NOTCE 产品停产通告 PDF 546 KB
PDN# : FS-15-02 Product Discontinuance Notice 产品停产通告 PDF 548 KB
PCN# : A1504-01 Change Silver Glass adhesive material 产品变更通告 PDF 27 KB
PCN# : A1403-01 Add OSET as Alternate Assembly 产品变更通告 PDF 67 KB
PDN# : FS-13-03 PRODUCT DISCONTINUANCE NOTICE 产品停产通告 PDF 55 KB
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w 产品变更通告 PDF 24 KB
PCN# A-0607-06 MMT Thailand as Alternate Assembly Facility for PLCC, SOIC 150mil/300mil 产品变更通告 PDF 223 KB
PCN# : A-0605-05 AIT as Alternate Assembly Facility for SOIC/QSOP/SSOP/TSSOP/PDIP 产品变更通告 PDF 298 KB
PCN#: TB-0512-01 Reel Color Changed from Blue to Black 产品变更通告 PDF 729 KB
PCN# A-0504-02R2: Assembly Transfer IDT-Manila to OSE-Ph 产品变更通告 PDF 38 KB
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph 产品变更通告 PDF 16 KB
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph 产品变更通告 PDF 47 KB
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT 产品变更通告 PDF 35 KB
PCN#: A-0501-01, New m/c DMC-2000 and d/a 8390A for PDIP pkgs 产品变更通告 PDF 42 KB
PCN#: A-0412-04 - To comply with Pb-free labels - Green Products 产品变更通告 PDF 80 KB
PCN#:A-0309-06 Rev1, Hermetic transfer to ATP-P1 产品变更通告 PDF 44 KB
PCN#: A-0305-04 Rev. 01, Tin Plating and Solder Dip Process at G 产品变更通告 PDF 38 KB
PCN#:A-0401-01, new m/c G600 & 8290 d/a material 产品变更通告 PDF 196 KB
PCN#: A-0310-01, Green Products 产品变更通告 PDF 26 KB
PCN#: A-0309-04, new mold compound G600 material 产品变更通告 PDF 134 KB
PCN# F0202-04R1: Wafer Fabrication Site Change 产品变更通告 PDF 50 KB
PCN# G-0203-05 Mold Compound 产品变更通告 PDF 40 KB
PCN# G0106-01, Moisture Sensitive Label Change 产品变更通告 PDF 274 KB
PDN for selected Military grade FIFO products 产品删除通告 PDF 45 KB
PCN# G0005-01, Laser Top Mark 产品变更通告 PDF 24 KB
PCN# G9911-05, To qualify low alpha mold compound. 产品变更通告 PDF 44 KB
Downloads
7200 IBIS 模型 - IBIS ZIP 9 KB
7200 HSPICE 模型 - HSPICE TAR 32 KB