Fast CMOS Buffer/Clock Driver

NOTICE - The following device(s) are recommended alternatives:

The FCT806 is an inverting buffer/clock driver built using advanced dual metal CMOS technology. Each bank consists of two banks of drivers. Each bank drives five output buffers from a standard TTL compatible input. These devices feature a "heart-beat" monitor for diagnostics and PLL driving. The MON output is identical to all other outputs and complies with the output specifications in this document. The FCT806 offers low capacitance inputs and hysteresis. Rail-to-rail output swing improves noise margin and allows easy interface with CMOS inputs.

Features

  • 0.5 MICRON CMOS Technology
  • Guaranteed low skew < 700ps (max.)
  • Low duty cycle distortion < 1ns (max.)
  • Low CMOS power levels
  • TTL compatible inputs and outputs
  • Rail-to-rail output voltage swing
  • High drive: -24mA IOH, +64mA IOL
  • Two independent output banks with 3-state control
  • 1:5 fanout per bank
  • "Heartbeat" monitor output
  • Available in SSOP and SOIC packages

Product Options

Orderable Part ID Part Status Pkg. Code Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
49FCT806APYG8 Last Time Buy PYG20 SSOP 20 C Yes Reel Availability
49FCT806ASOG Last Time Buy PSG20 SOIC 20 C Yes Tube Availability
49FCT806ASOG8 Last Time Buy PSG20 SOIC 20 C Yes Reel Availability
49FCT806PYG Last Time Buy PYG20 SSOP 20 C Yes Tube Availability
49FCT806PYG8 Last Time Buy PYG20 SSOP 20 C Yes Reel Availability
49FCT806APYG Last Time Buy PYG20 SSOP 20 C Yes Tube Availability

Technical Documentation

Title Other Languages Type Format File Size Date
Datasheets & Errata
49FCT806 Datasheet Datasheet PDF 70 KB May 16, 2010
Application Notes & White Papers
AN-828 Termination - LVPECL Application Note PDF 229 KB Jul 5, 2016
AN-815 Understanding Jitter Units Application Note PDF 476 KB Apr 23, 2014
AN-845 Termination - LVCMOS Application Note PDF 62 KB May 12, 2014
AN-844 Termination - AC Coupling Clock Receivers Application Note PDF 82 KB May 12, 2014
AN-842 Thermal Considerations in Package Design and Selection Application Note PDF 403 KB May 11, 2014
AN-840 Jitter Specifications for Timing Signals Application Note PDF 349 KB May 7, 2014
AN-834 Hot-Swap Recommendations Application Note PDF 67 KB May 5, 2014
AN-827 Application Relevance of Clock Jitter Application Note PDF 1.06 MB Apr 23, 2014
AN-805 Recommended Ferrite Beads Application Note PDF 38 KB Jan 14, 2014
AN-150 Clock and Signal Distribution Application Note PDF 74 KB Oct 25, 2013
AN-154: Estimating Power Dissipation in CMOS Application Note PDF 30 KB May 31, 1996
AN-82 Clock Distribution with Guaranteed Skew Application Note PDF 146 KB May 31, 1996
PCNs & PDNs
PDN# : CQ-17-04(R1) Product Discontinuance Notice Product Discontinuation Notice PDF 606 KB Nov 29, 2017
PDN# : CQ-17-04 Product Discontinuance Notice Product Discontinuation Notice PDF 599 KB Aug 24, 2017
PCN# : A1602-01(R1) Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB Apr 13, 2016
PCN# : A1602-01 Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB Feb 14, 2016
PCN# : TB1503-01R1 Carrier Tape Standardization for Selective Packages Product Change Notice PDF 333 KB Oct 21, 2015
PCN# : TB1503-01 Carrier Tape Standardization for Selective Packages Product Change Notice PDF 291 KB Jul 20, 2015
PCN# : A1305-01 Gold Wire to Copper Wire Product Change Notice PDF 148 KB Jul 28, 2013
PDN# Logic-00-12R1: Obsolete Industrial Grade Product Delete Notice PDF 149 KB Apr 23, 2001
PCN# G-0203-05 Mold Compound Product Change Notice PDF 40 KB Apr 15, 2002
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 16 KB Jul 21, 2005
PCN# A-0607-06 MMT Thailand as Alternate Assembly Facility for PLCC, SOIC 150mil/300mil Product Change Notice PDF 223 KB Oct 5, 2006
PCN# A-0504-02R2: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 38 KB Aug 3, 2005
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph Product Change Notice PDF 47 KB Apr 28, 2005
PCN#: A-0412-04 - To comply with Pb-free labels - Green Products Product Change Notice PDF 80 KB Dec 13, 2004
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB Nov 13, 2012
PCN# A-0508-02: OSET Alternate Assembly Location for Green Product Change Notice PDF 18 KB Sep 1, 2005
PCN#: A-0501-01, New m/c DMC-2000 and d/a 8390A for PDIP pkgs Product Change Notice PDF 42 KB Jan 24, 2005
PCN# G0106-01, Moisture Sensitive Label Change Product Change Notice PDF 274 KB Jun 10, 2001
PCN# G0005-01, Laser Top Mark Product Change Notice PDF 24 KB May 9, 2000
PCN#:A-0401-01, new m/c G600 & 8290 d/a material Product Change Notice PDF 196 KB Jan 18, 2004
PCN#:A-0312-02, new die attach material - 8290 Product Change Notice PDF 116 KB Dec 2, 2003
PCN#:A-0312-01, new mold compound material - G600 Product Change Notice PDF 109 KB Dec 2, 2003
PCN#: A-0310-01, Green Products Product Change Notice PDF 26 KB Oct 9, 2003
PCN # A-0406-07Rev.1, Qualify OSE-Taiwan for SSOP & TSSOP Product Change Notice PDF 21 KB Oct 21, 2004
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT Product Change Notice PDF 35 KB Apr 28, 2005
PCN# G9911-05, To qualify low alpha mold compound. Product Change Notice PDF 44 KB Nov 17, 1999
PCN# G0202-01, Alternate assembly facility Product Change Notice PDF 16 KB Feb 7, 2002
PCN#: A-0305-04 Rev. 01, Tin Plating and Solder Dip Process at G Product Change Notice PDF 38 KB Mar 3, 2004
PCN# : A-0605-05 AIT as Alternate Assembly Facility for SOIC/QSOP/SSOP/TSSOP/PDIP Product Change Notice PDF 298 KB May 24, 2006
PCN# : TB0808-04 QTY PER TUBE CHANGE FOR SSOP-20 Product Change Notice PDF 55 KB Oct 12, 2008
L0203-09R3 Product Change Notice PDF 32 KB Nov 27, 2007
Other
IDT Clock Distribution Overview 日本語 Overview PDF 3.79 MB Apr 24, 2016

Software & Tools

Title Other Languages Type Format File Size Date
49FCT806 Hspice Model Model - HSPICE ZIP 30 KB Mar 2, 2004
49FCT806 IBIS Model Model - IBIS ZIP 9 KB Mar 2, 2004