The QS3861 provides a set of ten high-speed CMOS TTL-compatible bus switches. The low ON resistance (5 ohm) of the QS3861 allows inputs to be connected without adding propagation delay and without generating additional ground bounce noise. The Bus Enable (BE) signal turns the switches on. The QS3861 operates at -40C to +85C.

特性

  • Enhanced N channel FET with no inherent diode to Vcc
  • 5 ohm bidirectional switches connect inputs to outputs
  • Zero propagation delay, zero ground bounce
  • Undershoot clamp diodes on all switch and control inputs
  • Available in 24 pin QSOP and TSSOP packages

产品选择

下单器件 ID Part Status Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
Active TSSOP 24 C 是的 Tube
Availability
Active TSSOP 24 C 是的 Reel
Availability
Active QSOP 24 C 是的 Tube
Availability
Active QSOP 24 C 是的 Reel
Availability

文档和下载

文档标题 其他语言 类型 文档格式 文件大小 日期
数据手册与勘误表
QS3861 Datasheet 数据手册 PDF 275 KB
使用指南与说明
FCT Bus Switch Cross Reference Guide 指南 PDF 568 KB
应用指南 &白皮书
AN-11: 5V and 3V Conversion with Zero Delay 应用文档 PDF 417 KB
Quickswitch Basics 应用文档 PDF 142 KB
AN-19: Space Reduction Via Placement 应用文档 PDF 41 KB
AN-09: CMOS Bus Switches Provide 0 Delay 应用文档 PDF 121 KB
AN-20: Board Assembly for 0.4mm Pin Surface Mounts 应用文档 PDF 62 KB
AN-17: Peripheral Isolation in Notebook Computers 应用文档 PDF 68 KB
AN-13: Converting TTL to Hot Plug 应用文档 PDF 85 KB
TN-07: Analysis of QuickSwitch Behavior 应用文档 PDF 102 KB
PCN / PDN
PCN# : A1808-01 Transfer Assembly Location from Amkor Philippines for select pacakges 产品变更通告 PDF 39 KB
PCN# : A1602-01(R1) Add Greatek Taiwan as Alternate Assembly 产品变更通告 PDF 611 KB
PCN# : A1602-01 Add Greatek Taiwan as Alternate Assembly 产品变更通告 PDF 611 KB
PCN# : A1511-01(R1) Add SPEL India as Alternate Assembly Location 产品变更通告 PDF 596 KB
PCN# : A1511-01 Add SPEL India as Alternate Assembly Location 产品变更通告 PDF 544 KB
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w 产品变更通告 PDF 24 KB
PCN# A-0508-02: OSET Alternate Assembly Location for Green 产品变更通告 PDF 18 KB
PCN# A-0504-02R2: Assembly Transfer IDT-Manila to OSE-Ph 产品变更通告 PDF 38 KB
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph 产品变更通告 PDF 16 KB
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph 产品变更通告 PDF 47 KB
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT 产品变更通告 PDF 35 KB
PCN#:A-0401-01, new m/c G600 & 8290 d/a material 产品变更通告 PDF 196 KB
PCN#:A-0312-02, new die attach material - 8290 产品变更通告 PDF 116 KB
PCN Addendum # L0203-10R1 Fab 2 to Fab 4 Transfer 产品变更通告 PDF 110 KB
PCN# G-0203-05 Mold Compound 产品变更通告 PDF 40 KB
PCN# L0203-10 Fab Transfer from Fab 2 to Fab 4 产品变更通告 PDF 27 KB
PCN# G0106-01, Moisture Sensitive Label Change 产品变更通告 PDF 274 KB
PCN# G0005-01, Laser Top Mark 产品变更通告 PDF 24 KB
PCN# G9911-05, To qualify low alpha mold compound. 产品变更通告 PDF 44 KB
Downloads
QS3861 Hspice 模型 - HSPICE ZIP 6 KB
QS3861 IBIS Model 模型 - IBIS ZIP 4 KB
其他
PDN# L_05_01: Obsolescence Notice ALL PDF 130 KB